Inventor · disambiguated record
Chih-Chung Hsu
Also filed as: HSU CHIH C · HSU CHIH-CHUNG
20 granted patents·7 pending applications·84 citations·filing 2001–2024
92Inventor score
Top patents by PatentIndex Score
27 records- 0195US11988867B2Package structure having photonic integrated circuitMOLEX LLC·Filed 2021·Granted May 21, 2024·4 cites·11 claims
- 0292US12442994B2Package structure having photonic integrated circuitMOLEX LLC·Filed 2024·Granted Oct 14, 2025·1 cites·6 claims
- 0392US11602908B1Method of mesh generation for resin transfer molding processCORETECH SYS CO LTD·Filed 2021·Granted Mar 14, 2023·4 cites·10 claims
- 0491US8030395B2Pressure sensitive adhesive dispersion having high solids and low viscosity and method of making same3M INNOVATIVE PROPERTIES CO·Filed 2007·Granted Oct 4, 2011·11 cites·17 claims
- 0589US9409335B1Computer-implemented simulation method and non-transitory computer medium for use in molding processCORETECH SYS CO LTD·Filed 2015·Granted Aug 9, 2016·8 cites·13 claims
- 0689US6660352B2Adhesive electrostatic sheets3M INNOVATIVE PROPERTIES CO·Filed 2001·Granted Dec 9, 2003·42 cites·26 claims
- 0788US11355361B1Method of measuring underfill profile of underfill cavity having solder bumpsCORETECH SYS CO LTD·Filed 2021·Granted Jun 7, 2022·2 cites·19 claims
- 0880US11521903B1Method of measuring voids in underfill packageCORETECH SYS CO LTD·Filed 2021·Granted Dec 6, 2022·1 cites·12 claims
- 0980US10960592B2Computer-implemented simulation method for injection-molding processCORETECH SYS CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·9 claims
- 1078US2024255697A1Package structure having photonic integrated circuitMOLEX LLC·Filed 2024·Application pending·0 cites
- 1173US8488913B2Method and system for example-based face hallucinationLIN CHIA-WEN·Filed 2010·Granted Jul 16, 2013·8 cites·13 claims
- 1264US9081923B1Computer-implemented composite simulation method and non-transitory computer medium for use in molding processCORETECH SYS CO LTD·Filed 2014·Granted Jul 14, 2015·2 cites·12 claims
- 1363US12326625B2Tiled light transmitting controllerINNOLUX CORP·Filed 2022·Granted Jun 10, 2025·0 cites·18 claims
- 1460US12235614B2Molding system for fabricating fiber reinforcement polymer composite article and molding method thereofCORETECH SYS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·17 claims
- 1552US11376776B2Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the sameCORETECH SYS CO LTD·Filed 2021·Granted Jul 5, 2022·0 cites·13 claims
- 1646US2002090509A1Electrostatic sheets with adhesive3M INNOVATIVE PROPERTIES CO·Filed 2001·Application pending·0 cites
- 1745US11988934B2Electronic deviceINNOLUX CORP·Filed 2022·Granted May 21, 2024·0 cites·17 claims
- 1845US10345495B2Stain resistant retroreflective articles3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted Jul 9, 2019·0 cites·18 claims
- 1945US2002088535A1Imaged electrostatic sheet delivery system3M INNOVATIVE PROPERTIES CO·Filed 2001·Application pending·0 cites
- 2044US9296926B2Overlaminate films and graphic articles containing themCONDON ROBERT R·Filed 2011·Granted Mar 29, 2016·0 cites·13 claims
- 2142US10752767B2Barrier and priming compositionsHSU CHIH-CHUNG·Filed 2011·Granted Aug 25, 2020·0 cites·11 claims
- 2240US10864667B2Molding system for preparing an in-mold decorated articleCORETECH SYS CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·11 claims
- 2338US2004047107A1ESD protection circuit for touch buttonFiled 2002·Application pending·0 cites
- 2436US11011275B2System and method for diagnosing gastrointestinal neoplasmAI SKOPY INC·Filed 2019·Granted May 18, 2021·0 cites·15 claims
- 2536US2011157510A1Panel fabricating method, panel and display panel structureCHIMEI INNOLUX CORP·Filed 2010·Application pending·0 cites
- 2635US2004043221A1Method of adhering a film and articles therefrom3M INNOVATIVE PROPERTIES CO·Filed 2002·Application pending·0 cites
- 2731US2012303967A1Digital rights management system and method for protecting digital contentCHIA YEN-TSUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →