Inventor · disambiguated record
Cheng-Chieh Hsu
Also filed as: HSU CHENG C · HSU CHENG-CHIEH
5 granted patents·5 pending applications·213 citations·filing 1999–2025
81Inventor score
Files withCYNTEC CO LTD2DARFON ELECTRONICS CORP1ECONET HK LTD1EDISON OPTO CORP1FIRST INT COMPUTER INC1
Top patents by PatentIndex Score
10 records- 0190US6215180B1Dual-sided heat dissipating structure for integrated circuit packageFIRST INT COMPUTER INC·Filed 1999·Granted Apr 10, 2001·141 cites·6 claims
- 0285US7405467B2Power module package structureCYNTEC CO LTD·Filed 2005·Granted Jul 29, 2008·15 cites·25 claims
- 0375US6130477AThin enhanced TAB BGA package having improved heat dissipationFiled 1999·Granted Oct 10, 2000·55 cites·20 claims
- 0450US7896690B1Electrical connection deviceEDISON OPTO CORP·Filed 2010·Granted Mar 1, 2011·2 cites·19 claims
- 0548US11258252B2On-chip surge protection circuitECONET HK LTD·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 0648US2025311274A1Package structure of high electron mobility transistorHIPER SEMICONDUCTOR INC·Filed 2025·Application pending·0 cites
- 0745US2009289595A1Wireless charging module and electronic apparatusDARFON ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 0840US2006220188A1Package structure having mixed circuit and composite substrateCYNTEC CO LTD·Filed 2005·Application pending·0 cites
- 0938US2012057832A1Integrated optical fiber connector componentSUN TSUNG-TING·Filed 2011·Application pending·0 cites
- 1035US2005093121A1Chip package and substrateFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →