Inventor · disambiguated record
Chien-Hao Hsu
Also filed as: HSU CHIEN-HAO
7 granted patents·7 pending applications·3 citations·filing 2019–2025
73Inventor score
Top patents by PatentIndex Score
14 records- 0190US11222859B2Semiconductor device structure with bonding pad and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0283US2025364461A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0383US2025357388A1Methods of forming mimcap corner structures in the keep-out zones of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0479US12476211B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0575US2025351303A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0670US2025227884A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0769US12482766B2MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 0868US12021048B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 0963US11791576B2Electrical connector assembly and electrical connector thereofPEGATRON CORP·Filed 2021·Granted Oct 17, 2023·0 cites·11 claims
- 1062US12009327B2Semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1161US2025191993A1Semiconductor device assembly with thermally-conductive filler in an inter-die gapMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1255US2025167104A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1354US2025218986A1Method for forming device substrate, method for forming package structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1453US11450588B2Method for forming chip package structure with heat conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →