Inventor · disambiguated record
Chia-Hao Hsu
Also filed as: HSU CHIA WEI · HSU CHIA-HAO · HSU CHIA-MING
92 granted patents·32 pending applications·525 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD42MEDIATEK INC17HSU CHIA-HAO13TAIWAN SEMICONDUCTOR MFG6IND TECH RES INST5
Top patents by PatentIndex Score
124 records- 0199US9869934B2Collector in an extreme ultraviolet lithography system with optimal air curtain protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·148 cites·20 claims
- 0298US11145623B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·23 cites·20 claims
- 0397US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0497US10867954B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·14 cites·20 claims
- 0597US10720401B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·18 cites·20 claims
- 0697US8765582B2Method for extreme ultraviolet electrostatic chuck with reduced clamp effectHSU CHIA-HAO·Filed 2012·Granted Jul 1, 2014·93 cites·20 claims
- 0796US11907027B2Gear synchronized dual axis pivot hingeDELL PRODUCTS LP·Filed 2021·Granted Feb 20, 2024·7 cites·11 claims
- 0896US11243578B2Gear synchronized dual axis pivot hingeDELL PRODUCTS LP·Filed 2019·Granted Feb 8, 2022·30 cites·9 claims
- 0995US11927991B2Synchronized hinges for foldable displaysDELL PRODUCTS LP·Filed 2021·Granted Mar 12, 2024·6 cites·20 claims
- 1095US11728314B2Methods of forming integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 1195US11619978B2Electronic device and hinge structureJAN CHENG SHIUE·Filed 2020·Granted Apr 4, 2023·5 cites·16 claims
- 1294US11978714B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·1 cites·18 claims
- 1394US8958237B1Static random access memory timing tracking circuitTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 17, 2015·28 cites·20 claims
- 1492US9377693B2Collector in an extreme ultraviolet lithography system with optimal air curtain protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·10 cites·20 claims
- 1591US11142932B2Dual-shaft hinge module and portable electronic deviceHSU CHIA HAO·Filed 2020·Granted Oct 12, 2021·4 cites·15 claims
- 1691US10444067B2Optical sensing apparatus and measuring method thereofIND TECH RES INST·Filed 2014·Granted Oct 15, 2019·14 cites·27 claims
- 1790US12087664B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2023·Granted Sep 10, 2024·1 cites·7 claims
- 1890US9128384B2Method of forming a patternTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 8, 2015·9 cites·16 claims
- 1988US11640930B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2020·Granted May 2, 2023·2 cites·14 claims
- 2087US12334464B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 2187US11019742B2Hinge structure and electronic device having the sameHSU CHIA HAO·Filed 2019·Granted May 25, 2021·10 cites·20 claims
- 2287US10515888B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·4 cites·20 claims
- 2386US11476184B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·3 cites·20 claims
- 2486US9964850B2Method to mitigate defect printability for ID patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 8, 2018·3 cites·20 claims
- 2586US2025273614A1Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2685US11621211B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 2784US9966804B2Outer-rotor permanent magnet brushless motorIND TECH RES INST·Filed 2015·Granted May 8, 2018·4 cites·5 claims
- 2883US10515869B1Semiconductor package structure having a multi-thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 2983US2024387465A1Integrated circuit packages and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3082US12261151B2Integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 3181US10782895B2Management method of metadata for preventing data loss and memory device using the sameWIWYNN CORP·Filed 2018·Granted Sep 22, 2020·3 cites·8 claims
- 3280US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 3380US9618856B2Method of overlay in extreme ultra-violet (EUV) lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·2 cites·20 claims
- 3479USD1025864SVehicle interiorFOXTRON VEHICLE TECH CO LTD·Filed 2021·Granted May 7, 2024·8 cites·1 claims
- 3579US9373552B2Method of calibrating or exposing a lithography toolTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 3679US2024363483A1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3778US11728238B2Semiconductor package with heat dissipation films and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·2 cites·21 claims
- 3878US11245293B2Motor stator with dovetail or rectangular mount structure and stator teeth airgap width ratioIND TECH RES INST·Filed 2019·Granted Feb 8, 2022·2 cites·9 claims
- 3978US10790795B1Zeroing structure applicable to adjustable diplexerUNIVERSAL MICROWAVE TECH INC·Filed 2019·Granted Sep 29, 2020·2 cites·5 claims
- 4077US12315786B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 4177US12080638B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 4277US12062590B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 13, 2024·1 cites·20 claims
- 4377US10003548B2Data transmission method using multiple wireless networksQISDA CORP·Filed 2015·Granted Jun 19, 2018·4 cites·18 claims
- 4477US8251641B2Stack of fan caseHSU CHIA-HAO·Filed 2008·Granted Aug 28, 2012·8 cites·6 claims
- 4577US2025273550A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4677US2025349779A1Die structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4775US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 4875US8579900B2Minimally invasive skeletal fixation deviceHSU CHIA-HAO·Filed 2010·Granted Nov 12, 2013·8 cites·1 claims
- 4974US11532585B2Package containing device dies and interconnect die and redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 5074US11334124B2Electronic deviceCHAO KAI CHENG·Filed 2021·Granted May 17, 2022·1 cites·13 claims
Showing the top 50 of 124 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →