Inventor · disambiguated record
Chia-Hsiung Hsu
Also filed as: HSU CHIA H · HSU CHIA HSIUNG
1 granted patent·2 pending applications·23 citations·filing 2004–2007
41Inventor score
Top patents by PatentIndex Score
3 records- 0188US7157734B2Semiconductor bond pad structures and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 2, 2007·23 cites·20 claims
- 0238US2008246147A1Novel substrate design for semiconductor deviceSU CHAO-YUAN·Filed 2007·Application pending·0 cites
- 0337US2006091535A1Fine pitch bonding pad layout and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →