Inventor · disambiguated record
Chi Wei Hsu
Also filed as: HSU CHI-WEI
0 granted patents·4 pending applications·0 citations·filing 2007–2024
Top patents by PatentIndex Score
4 records- 0157US2025022789A1Semiconductor package substrate with stress buffer pads and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0251US2025022810A1Semiconductor package substrate with stress buffer pads and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0344US2008242803A1Polypropylene derivatives and preparation thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 0442US2008161498A1Polypropylene derivatives and preparation thereofIND TECH RES INST·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →