Inventor · disambiguated record
Cheng-Hung Hu
Also filed as: HU CHENG-HUNG
3 granted patents·1 citations·filing 2013–2017
50Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0166US9982338B2High-throughput system and method for post-implantation single wafer warm-upTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·1 cites·20 claims
- 0249US9663854B2High-throughput system and method for post-implantation single wafer warm-upTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·0 cites·23 claims
- 0339US9196452B2Methods and apparatus for carbon ion source headTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →