Inventor · disambiguated record
Chun-Ping Hu
Also filed as: HU CHUN P · HU CHUN-PING
3 granted patents·3 pending applications·91 citations·filing 1976–2008
66Inventor score
Top patents by PatentIndex Score
6 records- 0194US4020151AMethod for quantitation of antigens or antibodies on a solid surfaceINT DIAGNOSTIC TECH·Filed 1976·Granted Apr 26, 1977·90 cites·10 claims
- 0255US7545038B2Bumping process and bump structureELAN MICROELECTRONICS CORP·Filed 2008·Granted Jun 9, 2009·1 cites·16 claims
- 0344US7544600B2Bumping process and bump structureELAN MICROELECTRONICS CORP·Filed 2006·Granted Jun 9, 2009·0 cites·19 claims
- 0437US2008088016A1Chip with bump structureHO MING-LING·Filed 2007·Application pending·0 cites
- 0535US2007187822A1Patterned gold bump structure for semiconductor chipCHEN YI-CHENG·Filed 2006·Application pending·0 cites
- 0634US2007187821A1Chip with bump structureHO MING-LING·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →