Inventor · disambiguated record
Chang-Hwang Hua
Also filed as: HUA CHANG-HWANG
22 granted patents·10 pending applications·576 citations·filing 1988–2022
94Inventor score
Top patents by PatentIndex Score
32 records- 0194US4978639AMethod for the simultaneous formation of via-holes and wraparound plating on semiconductor chipsAVANTEK·Filed 1989·Granted Dec 18, 1990·177 cites·8 claims
- 0294US4842699AMethod of selective via-hole and heat sink plating using a metal maskAVANTEK·Filed 1988·Granted Jun 27, 1989·145 cites·12 claims
- 0392US4808273AMethod of forming completely metallized via holes in semiconductorsAVANTEK·Filed 1988·Granted Feb 28, 1989·117 cites·17 claims
- 0482US8003532B2Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal filmWIN SEMICONDUCTORS CORP·Filed 2010·Granted Aug 23, 2011·8 cites·6 claims
- 0581US9673186B2Semiconductor integrated circuitWIN SEMICONDUCTORS CORP·Filed 2015·Granted Jun 6, 2017·4 cites·25 claims
- 0681US8835283B2Fabrication method for producing semiconductor chips with enhanced die strengthWIN SEMICONDUCTORS CORP·Filed 2013·Granted Sep 16, 2014·5 cites·18 claims
- 0778US9178007B1High breakdown voltage metal-insulator-metal capacitorWIN SEMICONDUCTORS CORP·Filed 2014·Granted Nov 3, 2015·6 cites·18 claims
- 0878US8497206B2Method of processing backside copper layer for semiconductor chipsHUA CHANG-HWANG·Filed 2010·Granted Jul 30, 2013·7 cites·22 claims
- 0976US9704829B2Stacked structure of semiconductor chips having via holes and metal bumpsWIN SEMICONDUCTORS CORP·Filed 2015·Granted Jul 11, 2017·2 cites·30 claims
- 1071US10410979B2Structure for reducing compound semiconductor wafer distortionWIN SEMICONDUCTORS CORP·Filed 2018·Granted Sep 10, 2019·1 cites·33 claims
- 1171US5288660AMethod for forming self-aligned t-shaped transistor electrodeAVANTEK·Filed 1993·Granted Feb 22, 1994·50 cites·17 claims
- 1270US5127984ARapid wafer thinning processAVANTEK·Filed 1991·Granted Jul 7, 1992·51 cites·14 claims
- 1369US9190374B2Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2013·Granted Nov 17, 2015·2 cites·14 claims
- 1468US10720390B2Ohmic metal structure for GaN deviceWIN SEMICONDUCTORS CORP·Filed 2017·Granted Jul 21, 2020·1 cites·7 claims
- 1551US11949008B2Semiconductor structure and method for forming the sameWIN SEMICONDUCTORS CORP·Filed 2020·Granted Apr 2, 2024·0 cites·20 claims
- 1650US10158212B1Structure for reducing compound semiconductor wafer distortionWIN SEMICONDUCTORS CORP·Filed 2017·Granted Dec 18, 2018·0 cites·13 claims
- 1746US8033011B2Method for mounting a thinned semiconductor wafer on a carrier substrateWIN SEMICONDUCTORS CORP·Filed 2008·Granted Oct 11, 2011·0 cites·6 claims
- 1846US2023317633A1Semiconductor chipWIN SEMICONDUCTORS CORP·Filed 2022·Application pending·0 cites
- 1940US11177379B2Gate-sinking pHEMTs having extremely uniform pinch-off/threshold voltageWIN SEMICONDUCTORS CORP·Filed 2019·Granted Nov 16, 2021·0 cites·18 claims
- 2039US2014209926A1Semiconductor integrated circuitWIN SEMICONDUCTORS CORP·Filed 2013·Application pending·0 cites
- 2138US2020373225A1Semiconductor integrated circuit and circuit layout method thereofWIN SEMICONDUCTORS CORP·Filed 2019·Application pending·0 cites
- 2238US2013277845A1Structure of backside copper metallization for semiconductor devices and a fabrication method thereofCHEN JASON·Filed 2012·Application pending·0 cites
- 2336US10096583B2Method for fabricating a semiconductor integrated chipWIN SEMICONDUCTORS CORP·Filed 2016·Granted Oct 9, 2018·0 cites·5 claims
- 2436US2018366417A1Structure for reducing compound semiconductor wafer distortionWIN SEMICONDUCTORS CORP·Filed 2017·Application pending·0 cites
- 2535US9548276B2Structure of backside copper metallization for semiconductor devices and a fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2015·Granted Jan 17, 2017·0 cites·14 claims
- 2635US2013099250A1Structure of semiconductor chips with enhanced die strength and a fabrication method thereofHUA CHANG-HWANG·Filed 2012·Application pending·0 cites
- 2734US10374129B2Compound semiconductors having an improved high temperature resistant backside metallizationWIN SEMICONDUCTORS CORP·Filed 2017·Granted Aug 6, 2019·0 cites·15 claims
- 2834US2013207266A1Copper Interconnect for III-V Compound Semiconductor DevicesHUA CHANG-HWANG·Filed 2012·Application pending·0 cites
- 2933US8911551B2Electroless plating apparatus and methodCHEN JASON·Filed 2011·Granted Dec 16, 2014·0 cites·4 claims
- 3033US2017222011A1Gate Metal Structure for Compound Semiconductor DevicesWIN SEMICONDUCTORS CORP·Filed 2016·Application pending·0 cites
- 3130US2017194451A1Schottky Barrier Semiconductor Device Having a Nanoscale Film InterfaceWIN SEMICONDUCTORS CORP·Filed 2016·Application pending·0 cites
- 3230US2017330843A1Advanced Moisture Resistant Structure of Compound Semiconductor Integrated CircuitsWIN SEMICONDUCTORS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →