Inventor · disambiguated record
Chang-Huang Hua
Also filed as: HUA CHANG-HUANG
1 granted patent·1 pending application·4 citations·filing 2011–2014
24Inventor score
Technology areasH10P
Top patents by PatentIndex Score
2 records- 0169US9287175B2Fabrication method for dicing of semiconductor wafers using laser cutting techniquesWIN SEMICONDUCTORS CORP·Filed 2014·Granted Mar 15, 2016·4 cites·2 claims
- 0225US2012115308A1Fabrication method for dicing of semiconductor wafers using laser cutting techniquesHUA CHANG-HUANG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →