Inventor · disambiguated record
Chia-Hsiu Huang
Also filed as: HUANG CHIA HSIU
6 granted patents·1 pending application·5 citations·filing 2013–2024
71Inventor score
Top patents by PatentIndex Score
7 records- 0193US11676912B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 13, 2023·3 cites·18 claims
- 0290US12074118B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Aug 27, 2024·1 cites·13 claims
- 0377US11462467B2Lead frame, package structure comprising the same and method for manufacturing the package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 4, 2022·1 cites·19 claims
- 0476US2024421103A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0543US9097407B2Slim border design of display device and backlight module thereofAU OPTRONICS CORP·Filed 2013·Granted Aug 4, 2015·0 cites·16 claims
- 0631US11367638B2Load portE&R ENG CORPORATION·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
- 0731US11189513B1Transport mechanism for wafers of different sizes and typesE&R ENG CORPORATION·Filed 2020·Granted Nov 30, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →