Inventor · disambiguated record
Chengder Huang
Also filed as: HUANG CHENGDER
2 granted patents·18 citations·filing 1999–2000
59Inventor score
Technology areasH10W
Files withVANGUARD INT SEMICONDUCT CORP2
Top patents by PatentIndex Score
2 records- 0150US6146924AMagnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding processVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Nov 14, 2000·15 cites·10 claims
- 0247US6400005B1Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding processVANGUARD INT SEMICONDUCT CORP·Filed 2000·Granted Jun 4, 2002·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →