Inventor · disambiguated record
Chun-Hsi Huang
Also filed as: HUANG CHUN-HSI
10 granted patents·3 pending applications·14 citations·filing 2018–2025
81Inventor score
Top patents by PatentIndex Score
13 records- 0192US11103970B2Chemical-mechanical planarization systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·11 cites·11 claims
- 0286US11679467B2Chemical-mechanical polishing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·1 cites·20 claims
- 0383US10974366B2Conditioning wheel for polishing padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 13, 2021·2 cites·20 claims
- 0478US12251789B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0576US2025269493A1Chemical mechanical polishing apparatus, method of conditioning polishing pad for chemical mechanical polishing, conditioning assembly for conditioning polishing pad used in chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0672US12103133B2Chemical-mechanical polishing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0770US2024308020A1Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0869US12325106B2Device for conditioning chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 10, 2025·0 cites·20 claims
- 0968US2025170688A1Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1065US12366595B2Voltage monitoring system, voltage monitoring device and voltage monitoring methodREALTEK SEMICONDUCTOR CORP·Filed 2022·Granted Jul 22, 2025·0 cites·12 claims
- 1159US12208487B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 28, 2025·0 cites·20 claims
- 1259US12059769B2Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·19 claims
- 1347US10807213B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →