Inventor · disambiguated record
Chih-Fan Huang
Also filed as: HUANG CHIH-FAN
59 granted patents·9 pending applications·167 citations·filing 2013–2025
98Inventor score
Top patents by PatentIndex Score
68 records- 0198US10157849B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·54 cites·20 claims
- 0296US9601353B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·28 cites·19 claims
- 0395US9847317B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 19, 2017·16 cites·20 claims
- 0493US11145564B2Multi-layer passivation structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·9 cites·20 claims
- 0592US11437331B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·6 cites·20 claims
- 0692US11342408B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 0791US11728375B2Metal-insulator-metal (MIM) capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0891US11716910B2MRAM structure for balanced loadingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·20 claims
- 0991US11670608B2Prevention of metal pad corrosion due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 1091US2025364457A1Chip structure with conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1188US10861810B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·5 cites·20 claims
- 1286US12477756B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 1385US12406952B2Chip structure with conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1485US10629508B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·2 cites·20 claims
- 1585US10043778B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·3 cites·20 claims
- 1685US9252135B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·4 cites·20 claims
- 1785US2025336428A1Structure and Method for MRAM Devices with a Slot ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1884US10734474B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·2 cites·19 claims
- 1983US10950514B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 16, 2021·1 cites·20 claims
- 2082US12183697B2Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 2182US11031458B2Metal-insulator-metal (MIM) capacitor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·2 cites·20 claims
- 2282US9530762B2Semiconductor package, semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 27, 2016·4 cites·30 claims
- 2381US10510719B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 2481US2025140722A1Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2580US11189538B2Semiconductor structure with polyimide packaging and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·3 cites·20 claims
- 2679US11923405B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 2779US9887162B2Molding structure for wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 6, 2018·4 cites·14 claims
- 2879US2024386932A1Structure and Method for MRAM Devices with a Slot ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2978US10050000B2Bump-on-trace structures with high assembly yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·2 cites·20 claims
- 3077US10269673B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·1 cites·20 claims
- 3177US9209149B2Bump-on-trace structures with high assembly yieldTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·3 cites·19 claims
- 3276US12057419B2Method for forming chip structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 3376US11937515B2MRAM structure for balanced loadingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 3476US2024373758A1Magnetic tunnel junction device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3575US11664287B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 3674US12027574B2Resistor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 3774US10468478B2Metal-insulator-metal (MIM) capacitor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 3874US10020211B2Wafer-level molding chase designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 10, 2018·3 cites·20 claims
- 3974US2024365564A1Structure and method for mram devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4074US2024389466A1Semiconductor memory device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4173US9324587B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·2 cites·20 claims
- 4272US11791371B2Resistor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 4372US11362170B2Metal-insulator-metal (MIM) capacitor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 4472US10510716B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 4570US12382838B2Semiconductor memory device with spacer protection and method for forming same using multi-step patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
- 4670US10163804B2Molding structure for wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·1 cites·20 claims
- 4769US12387772B2Structure and method for MRAM devices with a slot viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 12, 2025·0 cites·20 claims
- 4869US12082510B2Magnetic tunnel junction device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 4967US12063790B2Structure and method for MRAM devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 5067US9299688B2Packaged semiconductor devices and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 29, 2016·1 cites·20 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →