Inventor · disambiguated record
Chao-Hsien Huang
Also filed as: HUANG CHAO-HSIEN
28 granted patents·11 pending applications·57 citations·filing 2001–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD30ASUSTEK COMP INC3IND TECH RES INST3METAL IND RES & DEV CT2IND TECHNOLOGY RES CORP1
Top patents by PatentIndex Score
39 records- 0197US10361278B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·18 cites·20 claims
- 0294US10636891B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·10 cites·20 claims
- 0391US11776850B2Semiconductor device with reduced loading effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·1 cites·20 claims
- 0488US11646234B2Method for FinFET fabrication and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·1 cites·20 claims
- 0587US12396205B2Semiconductor device having fins and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0685US12261085B2Semiconductor device with reduced loading effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0785US11264281B2Semiconductor device with reduced loading effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·1 cites·20 claims
- 0885US11205706B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 21, 2021·3 cites·20 claims
- 0985US10157751B1Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 1082US12224210B2Method for FinFet fabrication and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1182US12125897B2Air spacers in transistors and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1281US12027625B2Semiconductor device having fins and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1381US11195759B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·2 cites·20 claims
- 1481US2025364312A1Method for forming a semiconductor device and devices fabricated thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1580US2025212497A1Semiconductor device with reduced loading effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1679US2025357246A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1778US2025185346A1Method For FinFET Fabrication And Structure ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1876US10861953B2Air spacers in transistors and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 1976US2024395626A1Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2076US2025329665A1Dielectric Slots Underneath Conductive Vias in Interconnect Structure of Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2173US11728221B2Air spacers in transistors and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 2272US11515423B2Semiconductor device having finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2371US12396245B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 2471US2024363395A1Method for forming a semiconductor device and devices fabricated thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2569US6592325B2Air-suspended die sorterIND TECH RES INST·Filed 2001·Granted Jul 15, 2003·15 cites·26 claims
- 2668US12406941B2Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 2765US10964795B2Air spacers in transistors and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 2865US2023420331A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2964US11056393B2Method for FinFET fabrication and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 3062US10680109B2CMOS semiconductor device having fins and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 3159US10755943B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
- 3252US2025112984A1Mobile electronic device and call volume adjustment method thereofASUSTEK COMP INC·Filed 2024·Application pending·0 cites
- 3347US12477063B2Processing method for priority notification of incoming call and mobile deviceASUSTEK COMP INC·Filed 2022·Granted Nov 18, 2025·0 cites·17 claims
- 3445US7198479B2Ejector with multi-ejection pinsIND TECH RES INST·Filed 2004·Granted Apr 3, 2007·2 cites·8 claims
- 3541US2018003441A1Method for manufacturing a nickel-titanium alloy using a high vacuum crucibleless levitation melting processMETAL IND RES & DEV CT·Filed 2016·Application pending·0 cites
- 3641US2018002782A1Device and method for manufacturing an active alloyMETAL IND RES & DEV CT·Filed 2016·Application pending·0 cites
- 3740US10949164B2Volume of sound adjustment method, electronic device thereof and non-transitory computer readable storage medium device thereofASUSTEK COMP INC·Filed 2020·Granted Mar 16, 2021·0 cites·13 claims
- 3834US6626280B2Tray-positioning deviceIND TECH RES INST·Filed 2001·Granted Sep 30, 2003·0 cites·3 claims
- 3926US6505528B2Device for fast taking out and putting inIND TECHNOLOGY RES CORP·Filed 2001·Granted Jan 14, 2003·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →