Inventor · disambiguated record
Ching-Han Huang
Also filed as: HUANG CHING-HAN
22 granted patents·6 pending applications·23 citations·filing 2004–2024
91Inventor score
Top patents by PatentIndex Score
28 records- 0193US10812017B1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 20, 2020·12 cites·17 claims
- 0281US2025115473A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0378US11081413B2Semiconductor package with inner and outer cavitiesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·3 cites·20 claims
- 0478US2025096774A1Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0576US12184266B2Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 31, 2024·0 cites·10 claims
- 0673US12168605B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 17, 2024·0 cites·16 claims
- 0770US10526200B2Semiconductor device package including cover including tilted inner sidewallADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 7, 2020·1 cites·18 claims
- 0866US11973048B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 30, 2024·0 cites·12 claims
- 0966US11588470B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·16 claims
- 1066US8088672B2Producing a transferred layer by implanting ions through a sacrificial layer and an etching stop layerLEE TIEN-HSI·Filed 2008·Granted Jan 3, 2012·6 cites·20 claims
- 1164US11296651B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 5, 2022·0 cites·5 claims
- 1264US2020140262A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1363US11101189B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 24, 2021·0 cites·18 claims
- 1462US10689249B2Semiconductor device package including a wall and a grounding ring exposed from the wallADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 23, 2020·1 cites·16 claims
- 1559US11014806B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 25, 2021·0 cites·17 claims
- 1657US11171108B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 9, 2021·0 cites·9 claims
- 1755US10689248B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1851US9850124B2Semiconductor device package for reducing parasitic light and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 26, 2017·0 cites·13 claims
- 1949US11565934B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 2049US11527671B2Optical package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 13, 2022·0 cites·16 claims
- 2149US11133278B2Semiconductor package including cap layer and dam structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·0 cites·21 claims
- 2247US11091365B2MEMS package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 17, 2021·0 cites·19 claims
- 2346US10782184B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 22, 2020·0 cites·20 claims
- 2443US9881845B1Electronic device, lid structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 30, 2018·0 cites·21 claims
- 2541US2010044827A1Method for making a substrate structure comprising a film and substrate structure made by same methodKINIK CO·Filed 2008·Application pending·0 cites
- 2640US10841679B2Microelectromechanical systems package structureADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Nov 17, 2020·0 cites·36 claims
- 2738US2005102819A1Surface film structure of a metallic bipolar plate for fuel cells and a method for producing the sameUNIV YUAN ZE·Filed 2004·Application pending·0 cites
- 2837US2006216553A1Fuel cell with bipolar plates having micro channels and its manufacturing methodLEE SHUO-JEN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →