Inventor · disambiguated record
Chung-Jen Huang
Also filed as: HUANG CHUNG-JEN
44 granted patents·24 pending applications·89 citations·filing 2002–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD48SUNONWEALTH ELECTR MACH IND CO8HUANG CHUNG-JEN6MOUNTAIN PNEUMATIC TOOLS CO LT2SYNAGE TECHNOLOGY CORP2
Top patents by PatentIndex Score
68 records- 0194US10128259B1Method for manufacturing embedded memory using high-K-metal-gate (HKMG) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·9 cites·20 claims
- 0292US12094984B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·1 cites·20 claims
- 0392US11532637B2Embedded flash memory cell including a tunnel dielectric layer having different thicknesses over a memory regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 0491US11349035B2Semiconductor device including non-volatile memory cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 0590US10504912B2Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·4 cites·20 claims
- 0689US10269909B1Memory device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·5 cites·20 claims
- 0788US10170488B1Non-volatile memory of semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 1, 2019·5 cites·20 claims
- 0887US10879257B2Integrated chip having a logic gate electrode and a tunnel dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·3 cites·20 claims
- 0987US10276728B2Semiconductor device including non-volatile memory cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 1085US12191282B2Shared pad/bridge layout for a 3D ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 1185US2024372011A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1284US2025105099A1Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1383US12165955B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1482US8878281B2Methods and apparatus for non-volatile memory cellsHUANG CHUNG-JEN·Filed 2012·Granted Nov 4, 2014·9 cites·19 claims
- 1580US12114503B2Integrated chip including a tunnel dielectric layer which has different thicknesses over a protrusion region of a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1680US7221069B2Balancing structure for motor rotorSUNONWEALTH ELECTR MACH IND CO·Filed 2005·Granted May 22, 2007·10 cites·17 claims
- 1779US2025357421A1Support structure to reinforce stacked semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1879US2025349618A1Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1979US2024371681A1Semiconductor feature and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2078US12107001B2Semiconductor feature and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 2178US10693018B2Method of manufacturing a semiconductor device including non-volatile memory cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·1 cites·20 claims
- 2276US11711917B2Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 2375US11854942B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2475US9799755B2Method for manufacturing memory device and method for manufacturing shallow trench isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·2 cites·18 claims
- 2575US2025316527A1Testing structure for an integrated chip having a high-voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2673US2025070092A1Shared pad/bridge layout for a 3d icTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2772US6658745B1Pneumatic power cutting toolMOUNTAIN PNEUMATIC TOOLS CO LT·Filed 2002·Granted Dec 9, 2003·18 cites·2 claims
- 2871US11764103B2Semiconductor feature and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 2971US10510765B2Memory device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·1 cites·20 claims
- 3070US12469817B2Support structure to reinforce stacked semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 3168US2023377968A1Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3267US12144173B2Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 3367US11114452B2Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 3467US10290722B2Memory device and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 14, 2019·1 cites·20 claims
- 3566US10937795B2Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
- 3665US12482698B2Testing structure for an integrated chip having a high-voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 3764US11342025B2Non-volatile memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 3864US11189546B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 3962US11158647B2Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 4062US7633687B2Linear micro motorSUNOWEALTH ELECTRIC MACHINE IN·Filed 2008·Granted Dec 15, 2009·3 cites·12 claims
- 4157US11024637B2Embedded non-volatile memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4257US10269822B2Method to fabricate uniform tunneling dielectric of embedded flash memory cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
- 4356US10720214B2Non-volatile memory device and method for controlling the non-volatile memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 4454USD474089SPneumatic power cutting toolMOUNTAIN PNEUMATIC TOOLS CO LT·Filed 2002·Granted May 6, 2003·9 cites·1 claims
- 4554US2010041454A1Portable dance game systemHUANG CHUNG-JEN·Filed 2008·Application pending·0 cites
- 4653US2024021515A1Semiconductor structure and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4753US2009197678A1Pretend play toy with reality and virtual interactionHUANG CHUNG-JEN·Filed 2008·Application pending·0 cites
- 4851US11121047B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 4951US10204917B2Method for manufacturing embedded non-volatile memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 12, 2019·0 cites·20 claims
- 5051US2024153895A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →