Inventor · disambiguated record
Chang-Pin Huang
Also filed as: HUANG CHANG-PIN
31 granted patents·85 citations·filing 2010–2023
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
31 records- 0196US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
- 0296US9627332B1Integrated circuit structure and seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·22 cites·20 claims
- 0385US9947630B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 0485US9048149B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·6 cites·20 claims
- 0582US12278199B2Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0682US10354986B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·20 claims
- 0782US9559044B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·20 claims
- 0881US10985121B2Bump structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·2 cites·20 claims
- 0981US9786618B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 1081US9461106B1MIM capacitor and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·4 cites·20 claims
- 1179US8963328B2Reducing delamination between an underfill and a buffer layer in a bond structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·4 cites·19 claims
- 1278US9852985B1Conductive terminal on integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
- 1378US9799615B1Package structures having height-adjusted molding members and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·3 cites·19 claims
- 1477US10269737B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 1575US10262958B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 16, 2019·1 cites·20 claims
- 1673US11837562B2Conductive bump of a semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 1773US11469200B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1873US10163828B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·2 cites·14 claims
- 1973US9484318B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·2 cites·19 claims
- 2067US8610267B2Reducing delamination between an underfill and a buffer layer in a bond structureYANG CHING-JUNG·Filed 2010·Granted Dec 17, 2013·2 cites·19 claims
- 2164US10825804B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 2262US10879198B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 2360US10854564B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 2458US9812434B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 7, 2017·0 cites·20 claims
- 2557US9343417B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·0 cites·21 claims
- 2656US10032737B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 2756US9679883B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 2849US9318456B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 19, 2016·0 cites·19 claims
- 2941US10062654B2Semicondcutor structure and semiconductor manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·14 claims
- 3041US9943239B2Optical sensing system and associated electronic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·20 claims
- 3140US9748212B2Shadow pad for post-passivation interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →