Inventor · disambiguated record
Chi-Chih Huang
Also filed as: HUANG CHI-CHIH
17 granted patents·9 pending applications·58 citations·filing 2006–2023
91Inventor score
Files withOMNIVISION TECH INC15ADVANCED SEMICONDUCTOR ENG3IMPAC TECHNOLOGY CO LTD2ADVANCED SEMICONDUCTOR ENGINIE1HEWLETT PACKARD DEVELOPMENT CO1
Top patents by PatentIndex Score
26 records- 0193US9935144B1System-in-package image sensorOMNIVISION TECH INC·Filed 2016·Granted Apr 3, 2018·10 cites·8 claims
- 0293US9748293B1Image sensor packages with folded cover-glass sealing interfaceOMNIVISION TECH INC·Filed 2016·Granted Aug 29, 2017·11 cites·13 claims
- 0392US9349763B1Curved image sensor systems and methods for manufacturing the sameOMNIVISION TECH INC·Filed 2015·Granted May 24, 2016·8 cites·17 claims
- 0486US10243014B2System-in-package image sensorOMNIVISION TECH INC·Filed 2018·Granted Mar 26, 2019·4 cites·5 claims
- 0585US7550375B2Method for forming metal bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·15 cites·25 claims
- 0684US11201124B2Semiconductor devices, semiconductor wafers, and methods of manufacturing the sameOMNIVISION TECH INC·Filed 2019·Granted Dec 14, 2021·4 cites·16 claims
- 0777US11973098B2Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making sameOMNIVISION TECH INC·Filed 2022·Granted Apr 30, 2024·0 cites·15 claims
- 0870US7811861B2Image sensing device and packaging method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2008·Granted Oct 12, 2010·2 cites·8 claims
- 0960US7560650B2Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENGINIE·Filed 2006·Granted Jul 14, 2009·4 cites·15 claims
- 1058US11515347B2Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making sameLIN WEI FENG·Filed 2020·Granted Nov 29, 2022·0 cites·9 claims
- 1158US2024387588A1Image sensor packages and method thereofOMNIVISION TECH INC·Filed 2023·Application pending·0 cites
- 1257US10185191B2Panel carrier and method for attaching a liquid-crystal-on-silicon panel theretoOMNIVISION TECH INC·Filed 2016·Granted Jan 22, 2019·0 cites·12 claims
- 1353US8084790B2Image sensing device and packaging method thereofHUANG CHI-CHIH·Filed 2010·Granted Dec 27, 2011·0 cites·9 claims
- 1453US2020357842A1Image sensor module having protective structure that blocks incident light to arrive at bonding wires and padsOMNIVISION TECH INC·Filed 2020·Application pending·0 cites
- 1552US11562928B2Laser marked code pattern for representing tracing number of chipOMNIVISION TECH INC·Filed 2019·Granted Jan 24, 2023·0 cites·19 claims
- 1652US9679931B2Curved image sensor systemsOMNIVISION TECH INC·Filed 2016·Granted Jun 13, 2017·0 cites·11 claims
- 1752US2019027531A1Image sensor module having protective structureOMNIVISION TECH INC·Filed 2017·Application pending·0 cites
- 1849US11164708B2Backlit switchesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 2, 2021·0 cites·15 claims
- 1945US2016141280A1Device-Embedded Image Sensor, And Wafer-Level Method For Fabricating SameOMNIVISION TECH INC·Filed 2014·Application pending·0 cites
- 2045US2016148966A1Space-Efficient PCB-Mountable Image Sensor, And Method For Fabricating SameOMNIVISION TECH INC·Filed 2014·Application pending·0 cites
- 2144US2009224344A1Packaging method of image sensing deviceIMPAC TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 2243US7795722B2Substrate strip and substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 14, 2010·0 cites·14 claims
- 2342US2009289857A1Portable electronic device with a replaceable antenna moduleHUANG HUNG-MING·Filed 2008·Application pending·0 cites
- 2441US2007232051A1Method for forming metal bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2538US2009215216A1Packaging method of image sensing deviceIMPAC TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 2637US10163954B2Trenched device wafer, stepped-sidewall device die, and associated methodOMNIVISION TECH INC·Filed 2016·Granted Dec 25, 2018·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Chi-Chih Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →