Inventor · disambiguated record
Chih-Chun Huang
Also filed as: HUANG CHIH CHUN
7 granted patents·5 pending applications·51 citations·filing 1998–2023
81Inventor score
Files withADATA TECH CO LTD4AMA PRECISION INC2HON HAI PREC IND CO LTD1TAI CHUN-CHIA1TAIWAN SEMICONDUCTOR MFG CO LTD1
Top patents by PatentIndex Score
12 records- 0189US10152097B1Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating functionADATA TECH CO LTD·Filed 2018·Granted Dec 11, 2018·9 cites·9 claims
- 0278USD919614SComputer caseADATA TECH CO LTD·Filed 2019·Granted May 18, 2021·19 cites·1 claims
- 0370USD939497SComputer caseADATA TECH CO LTD·Filed 2019·Granted Dec 28, 2021·13 cites·1 claims
- 0457US12151427B2Housing structure manufacturing method and electronic deviceADATA TECH CO LTD·Filed 2019·Granted Nov 26, 2024·0 cites·10 claims
- 0555US2024268071A1Heat dissipation structure and heat dissipation assembly including the sameWISTRON CORP·Filed 2023·Application pending·0 cites
- 0652US10725212B2LensYOUNG OPTICS INC·Filed 2018·Granted Jul 28, 2020·0 cites·7 claims
- 0741US6225209B1Method of fabricating crack resistant inter-layer dielectric for a salicide processUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 1, 2001·10 cites·6 claims
- 0839US2007103871A1Heat dissipation moduleAMA PRECISION INC·Filed 2006·Application pending·0 cites
- 0939US2007111594A1Clip assemblyAMA PRECISION INC·Filed 2006·Application pending·0 cites
- 1036US2013136370A1Method for describing characteristics of drawn objects by a text stringTAI CHUN-CHIA·Filed 2012·Application pending·0 cites
- 1135US2016069541A1LampHON HAI PREC IND CO LTD·Filed 2015·Application pending·0 cites
- 1233US11104996B2Heating stage and apparatus having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →