Inventor · disambiguated record
Chien-Ping Huang
Also filed as: HUANG CHIEN P · HUANG CHIEN-PING
244 granted patents·87 pending applications·9,882 citations·filing 1996–2024
99Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD264HUANG CHIEN-PING8CHANG CHIANG-CHENG5DELTA ELECTRONICS INC5HERMES-EPITEK CORP5
Top patents by PatentIndex Score
331 records- 0199US6828665B2Module device of stacked semiconductor packages and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 7, 2004·249 cites·14 claims
- 0299US6559525B2Semiconductor package having heat sink at the outer surfaceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 6, 2003·294 cites·7 claims
- 0399US6545332B2Image sensor of a quad flat packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 8, 2003·432 cites·10 claims
- 0499US6384472B1Leadless image sensor package structure and method for making the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 7, 2002·480 cites·15 claims
- 0598US6667546B2Ball grid array semiconductor package and substrate without power ring or ground ringSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 23, 2003·218 cites·20 claims
- 0698US6590281B2Crack-preventive semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jul 8, 2003·179 cites·8 claims
- 0798US6414385B1Quad flat non-lead package of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jul 2, 2002·335 cites·15 claims
- 0898US6218731B1Tiny ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Apr 17, 2001·384 cites·24 claims
- 0998US6198171B1Thermally enhanced quad flat non-lead package of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Mar 6, 2001·357 cites·6 claims
- 1097US6593662B1Stacked-die package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 15, 2003·203 cites·26 claims
- 1197US6525942B2Heat dissipation ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Feb 25, 2003·199 cites·15 claims
- 1297US6507104B2Semiconductor package with embedded heat-dissipating deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 14, 2003·147 cites·11 claims
- 1397US6444498B1Method of making semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 3, 2002·146 cites·19 claims
- 1497US6369455B1Externally-embedded heat-dissipating device for ball grid array integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 9, 2002·149 cites·14 claims
- 1596US7934313B1Package structure fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted May 3, 2011·132 cites·32 claims
- 1696US7772685B2Stacked semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Aug 10, 2010·44 cites·8 claims
- 1796US7364944B2Method for fabricating thermally enhanced semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Apr 29, 2008·46 cites·10 claims
- 1896US6630729B2Low-profile semiconductor package with strengthening structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 7, 2003·116 cites·8 claims
- 1995US7443016B2Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulantSILICON PREC IND CO LTD·Filed 2005·Granted Oct 28, 2008·73 cites·10 claims
- 2095US7102239B2Chip carrier for semiconductor chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 5, 2006·98 cites·8 claims
- 2195US6777819B2Semiconductor package with flash-proof deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 17, 2004·106 cites·7 claims
- 2295US6414384B1Package structure stacking chips on front surface and back surface of substrateSILICON PREC IND CO LTD·Filed 2000·Granted Jul 2, 2002·131 cites·20 claims
- 2395US6359341B1Ball grid array integrated circuit package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·114 cites·20 claims
- 2495US6246111B1Universal lead frame type of quad flat non-lead package of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 12, 2001·129 cites·11 claims
- 2594US8154115B1Package structure having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Apr 10, 2012·16 cites·15 claims
- 2694US7371617B2Method for fabricating semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted May 13, 2008·29 cites·13 claims
- 2794US7271483B2Bump structure of semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 18, 2007·76 cites·18 claims
- 2894US7208825B2Stacked semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 24, 2007·35 cites·4 claims
- 2994US7170152B2Wafer level semiconductor package with build-up layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 30, 2007·73 cites·11 claims
- 3094US6767753B2Image sensor of a quad flat packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jul 27, 2004·87 cites·9 claims
- 3194US6764880B2Semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jul 20, 2004·83 cites·10 claims
- 3294US6650009B2Structure of a multi chip module having stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·102 cites·18 claims
- 3394US6570249B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted May 27, 2003·84 cites·8 claims
- 3494US6555902B2Multiple stacked-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 29, 2003·91 cites·15 claims
- 3594US6443351B1Method of achieving solder ball coplanarity on ball grid array integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 3, 2002·96 cites·10 claims
- 3693US7679172B2Semiconductor package without chip carrier and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Mar 16, 2010·33 cites·27 claims
- 3793US7638879B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 29, 2009·26 cites·9 claims
- 3893US7274088B2Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Sep 25, 2007·69 cites·8 claims
- 3993US6661089B2Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 9, 2003·65 cites·8 claims
- 4093US6396707B1Ball grid array packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted May 28, 2002·145 cites·11 claims
- 4192US7423340B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 9, 2008·25 cites·12 claims
- 4292US7315078B2Chip-stacked semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Jan 1, 2008·20 cites·8 claims
- 4392US6870274B2Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 22, 2005·57 cites·15 claims
- 4492US6657296B2Semicondctor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 2, 2003·72 cites·11 claims
- 4592US6353257B1Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash preventionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 5, 2002·73 cites·11 claims
- 4692US6246115B1Semiconductor package having a heat sink with an exposed surfaceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jun 12, 2001·170 cites·14 claims
- 4791US7355279B2Semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 8, 2008·27 cites·14 claims
- 4891US6528876B2Semiconductor package having heat sink attached to substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 4, 2003·64 cites·15 claims
- 4991US6521997B1Chip carrier for accommodating passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Feb 18, 2003·84 cites·9 claims
- 5091US6462405B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 8, 2002·70 cites·20 claims
Showing the top 50 of 331 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →