Inventor · disambiguated record
Chien-Mei Huang
Also filed as: HUANG CHIEN-MEI
8 granted patents·3 pending applications·5 citations·filing 2017–2025
77Inventor score
Files withADVANCED SEMICONDUCTOR ENG11
Top patents by PatentIndex Score
11 records- 0187US11018120B2Semiconductor device package with stress buffering layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·4 cites·17 claims
- 0282US2025273638A1Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0380US12300677B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·13 claims
- 0471US11721678B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
- 0570US10643937B2Wiring structure, electronic device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 5, 2020·1 cites·27 claims
- 0668US12218075B2Package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 4, 2025·0 cites·18 claims
- 0765US2025183197A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0863US11031326B2Wiring structure, electronic device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 8, 2021·0 cites·16 claims
- 0962US12513815B2Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1058US2025343213A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1139US10522492B2Semiconductor package and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 31, 2019·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →