Inventor · disambiguated record
Chung-Hsien Hun
Also filed as: Hun Chung-Hsien
1 granted patent·2 pending applications·14 citations·filing 2015–2025
36Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0191US9527721B2Movement microelectromechanical systems (MEMS) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·14 cites·20 claims
- 0276US2025357449A1Chip-on-wafer-on-board structure using spacer die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0362US2023420429A1Chip-on-wafer-on-board structure using spacer die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →