Inventor · disambiguated record

Chi-Cheng Hung

Also filed as: HUNG CHI-CHENG

75 granted patents·13 pending applications·265 citations·filing 1995–2025

98Inventor score

Technology areasH10D H10P H10W H01L G03F

Files withTAIWAN SEMICONDUCTOR MFG CO LTD66 LYONTEK INC6 TAIWAN SEMICONDUCTOR MFG4 SDI CORP3 WINBOND ELECTRONICS CORP3

Top patents by PatentIndex Score

88 records

0198US9620610B1FinFET gate structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·22 cites·19 claims
0296US12021147B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
0395US10985061B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·8 cites·20 claims
0495US10483165B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·8 cites·20 claims
0594US10186456B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·8 cites·20 claims
0694US10049918B2Directional patterning methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·9 cites·20 claims
0793US11563120B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·20 claims
0893US10833196B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·5 cites·20 claims
0993US10658184B2Pattern fidelity enhancement with directional patterning technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 19, 2020·7 cites·12 claims
1093US10090206B2FinFET gate structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·6 cites·20 claims
1191US9947753B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 17, 2018·6 cites·15 claims
1289US9991132B2Lithographic technique incorporating varied pattern materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 5, 2018·5 cites·20 claims
1389US9837507B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·5 cites·16 claims
1489US9449880B1Fin patterning methods for increased process marginTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·6 cites·20 claims
1588US10516034B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
1687US10714576B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·3 cites·20 claims
1785US2024363409A1Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1884US10157785B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
1983US2025361602A1Tungsten deposition on a cobalt surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2082US10867845B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·14 claims
2182US8372719B2Hard mask removal for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 12, 2013·5 cites·20 claims
2281US12507458B2Semiconductor device with dielectric spacer liner on source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
2381US9728407B2Method of forming features with various dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·3 cites·20 claims
2480US12356656B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
2579US10157998B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
2679US5864309ASerial data timing base modulatorWINBOND ELECTRONICS CORP·Filed 1996·Granted Jan 26, 1999·46 cites·47 claims
2778US11901188B2Method for improved critical dimension uniformity in a semiconductor device fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
2878US10755938B2Metal gate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·2 cites·20 claims
2978US10714357B2Methods for improved critical dimension uniformity in a semiconductor device fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·1 cites·20 claims
3078US9870995B2Formation of copper layer structure with self anneal strain improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 16, 2018·2 cites·20 claims
3178USD735552SCutter knifeSDI CORP·Filed 2014·Granted Aug 4, 2015·21 cites·1 claims
3276US10146141B2Lithography process and system with enhanced overlay qualityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 4, 2018·2 cites·20 claims
3375US2024360548A1Tungsten deposition on a cobalt surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3473US12068197B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
3573US11616132B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
3673US10269918B2N-work function metal with crystal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·39 claims
3773US2024249977A1Metal adhesion layer to promote metal plug adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3872US11289338B2Method for improved critical dimension uniformity in a semiconductor device fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
3972US10497811B2FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 3, 2019·1 cites·20 claims
4072US5710573AScaled video output overlaid onto a computer graphics outputWINBOND ELECTRONICS CORP·Filed 1995·Granted Jan 20, 1998·49 cites·26 claims
4171US11670690B2Semiconductor device with dielectric spacer liner on source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
4269US9508817B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·2 cites·20 claims
4368US10749278B2Method of electroplating metal into recessed feature and electroplating layer in recessed featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 18, 2020·0 cites·20 claims
4467US11158509B2Pattern fidelity enhancement with directional patterning technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
4567US11031486B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·18 claims
4666US12065731B2Tungsten deposition on a cobalt surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
4766US9530660B2Multiple directed self-assembly patterning processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·1 cites·20 claims
4866US9457483B2Cutter assembly having dual locking effectSDI CORP·Filed 2014·Granted Oct 4, 2016·4 cites·27 claims
4965US8173548B2Reverse planarization methodHUNG CHI-CHENG·Filed 2010·Granted May 8, 2012·2 cites·20 claims
5065US2024332374A1Contact Formation Method and Related StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

Showing the top 50 of 88 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →