Inventor · disambiguated record
Chih-Cheng Hung
Also filed as: HUNG CHIH-CHENG
8 granted patents·3 pending applications·80 citations·filing 1999–2021
83Inventor score
Files withADVANCED SEMICONDUCTOR ENG5KENNESAW STATE UNIV RESEARCH AND SERVICE FOUNDATION INC4LIN YU-LIANG1
Top patents by PatentIndex Score
11 records- 0192US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0275US6216825B1Brake mechanismFiled 1999·Granted Apr 17, 2001·43 cites·2 claims
- 0372US10713500B2Identification and classification of traffic conflicts using live video imagesKENNESAW STATE UNIV RESEARCH AND SERVICE FOUNDATION INC·Filed 2017·Granted Jul 14, 2020·2 cites·19 claims
- 0468US10572978B2Moran's / for impulse noise detection and removal in color imagesKENNESAW STATE UNIV RESEARCH AND SERVICE FOUNDATION INC·Filed 2017·Granted Feb 25, 2020·1 cites·10 claims
- 0564US11380105B2Identification and classification of traffic conflictsKENNESAW STATE UNIV RESEARCH AND SERVICE FOUNDATION INC·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 0660US8357998B2Wirebonded semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 22, 2013·2 cites·20 claims
- 0757US10902563B2Moran's / for impulse noise detection and removal in color imagesKENNESAW STATE UNIV RESEARCH AND SERVICE FOUNDATION INC·Filed 2019·Granted Jan 26, 2021·0 cites·9 claims
- 0855US11594511B2Bonding device and bonding methodADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 28, 2023·0 cites·13 claims
- 0941US2010200981A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 1038US2006091567A1Cavity-down Package and Method for Fabricating the sameLIN YU-LIANG·Filed 2005·Application pending·0 cites
- 1131US2021130163A1Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →