Inventor · disambiguated record
Chin-Hsien Hung
Also filed as: HUNG CHIN-HSIEN
10 granted patents·2 pending applications·6 citations·filing 2008–2020
79Inventor score
Top patents by PatentIndex Score
12 records- 0183US10575401B1Dielectric composite and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Feb 25, 2020·1 cites·18 claims
- 0278US10662352B2Adhesive composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 26, 2020·1 cites·20 claims
- 0376US8488299B2Capacitor structureWU SHIH-HSIEN·Filed 2010·Granted Jul 16, 2013·4 cites·13 claims
- 0472US11345813B2Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 31, 2022·0 cites·14 claims
- 0567US11124613B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Sep 21, 2021·0 cites·19 claims
- 0664US11124614B2Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Sep 21, 2021·0 cites·17 claims
- 0761US10836919B2Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Nov 17, 2020·0 cites·14 claims
- 0855US11015052B2Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 25, 2021·0 cites·16 claims
- 0951US11312829B2Flexible prepreg and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Apr 26, 2022·0 cites·14 claims
- 1050US10246588B1Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 1148US2022288075A1Method and composition for treating painACADEMIA SINICA·Filed 2020·Application pending·0 cites
- 1247US2009227719A1Curable High Dielectric Constant Ink Composition and High Dielectric FilmIND TECH RES INST·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →