Inventor · disambiguated record
Chia-Ming Hung
Also filed as: HUNG CHIA-MING
37 granted patents·13 pending applications·158 citations·filing 2008–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD35TAIWAN SEMICONDUCTOR MFG5SHU CHIA-PAO3CHUNG TIEN-KAN2LITE ON TECHNOLOGY CORP2
Top patents by PatentIndex Score
50 records- 0197US9567204B2Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·18 cites·20 claims
- 0296US8716852B2Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the sameSHU CHIA-PAO·Filed 2012·Granted May 6, 2014·26 cites·20 claims
- 0395US10392244B2Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 27, 2019·9 cites·20 claims
- 0495US9656857B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·13 cites·20 claims
- 0592US10131540B2Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 20, 2018·9 cites·20 claims
- 0692US9365416B2Structure and method for motion sensorSHU CHIA-PAO·Filed 2012·Granted Jun 14, 2016·12 cites·31 claims
- 0790US11834332B2Bond wave optimization method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·1 cites·20 claims
- 0889US9266714B2Micro-electro mechanical system (MEMS) structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·6 cites·20 claims
- 0987US9845236B2Monolithic MEMS platform for integrated pressure, temperature, and gas sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·4 cites·20 claims
- 1087US8878312B2Electrical bypass structure for MEMS deviceHUNG CHIA-MING·Filed 2011·Granted Nov 4, 2014·16 cites·15 claims
- 1186US9630832B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·6 cites·20 claims
- 1286US9392674B2Environment detection device and environment detection method suitable for street lampLITE ON TECHNOLOGY CORP·Filed 2014·Granted Jul 12, 2016·10 cites·25 claims
- 1385US9202792B2Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 1, 2015·7 cites·18 claims
- 1485US8928162B2Sensor with energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 6, 2015·4 cites·20 claims
- 1584US8232614B1Package systems having a conductive element through a substrate thereof and manufacturing methods of the sameCHU CHIA-HUA·Filed 2011·Granted Jul 31, 2012·6 cites·20 claims
- 1682US2024367965A1Conductive bond structure to increase membrane sensitivty in mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1781US11491510B2Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·1 cites·20 claims
- 1880US12162749B2Bond wave optimization method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1979US12139399B2Conductive bond structure to increase membrane sensitivity in MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2079US2025338516A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2179US2024375943A1Dielectric protection layer configured to increase performance of mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2278US2025250163A1A semiconductor device comprising different types of microelectromechanical systems devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2377US10266396B2MEMS device with enhanced sensing structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 2476US12304807B2Semiconductor device comprising different types of microelectromechanical systems devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 2576US9856139B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·1 cites·20 claims
- 2674US12257602B2Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 2774US2025329594A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2874US2025214108A1Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2973US9776858B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·2 cites·20 claims
- 3073US2024395897A1Semiconductor device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3171US12269735B2Dielectric protection layer configured to increase performance of mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 3271US10464808B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 3370US11292715B2Conductive bond structure to increase membrane sensitivity in MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
- 3468US12507426B2Semiconductor device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 3568US8723280B2Hybrid MEMS bump design to prevent in-process and in-use stictionSHU CHIA-PAO·Filed 2012·Granted May 13, 2014·2 cites·20 claims
- 3665US12400926B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 3765US8723343B2Sensor with energy-harvesting deviceCHUNG TIEN-KAN·Filed 2011·Granted May 13, 2014·1 cites·20 claims
- 3863US10981781B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 3962US9584003B2Energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 4062US9246401B2Energy-harvesting device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 26, 2016·0 cites·20 claims
- 4160US2025058353A1Semiconductor ultrasonic transducer device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4257US8410665B2MEMS kinetic energy conversionCHUNG TIEN-KAN·Filed 2010·Granted Apr 2, 2013·1 cites·14 claims
- 4356US8763220B2Method of manufacturing a MEMS deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 1, 2014·0 cites·18 claims
- 4455US2025208445A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4554US2025370309A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4653US11851323B2Semiconductor device comprising different types of microelectromechanical systems devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 4753US9714166B2Thin film structure for hermetic sealingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 25, 2017·0 cites·21 claims
- 4853US2023278073A1Semiconductor device with improved dielectric film structure and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4946US2015112455A1Control device with automatic adjustmentLITE ON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 5042US2009057789A1Package structure for micro-sensorHUANG LONG SUN·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chia-Ming Hung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →