Inventor · disambiguated record
Chin-Yuan Hung
Also filed as: HUNG CHIN-YUAN
8 granted patents·1 pending application·743 citations·filing 2000–2002
91Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD8
Top patents by PatentIndex Score
9 records- 0197US6476474B1Dual-die package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Nov 5, 2002·245 cites·10 claims
- 0295US6476469B2Quad flat non-leaded package structure for housing CMOS sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 5, 2002·277 cites·13 claims
- 0391US6509636B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jan 21, 2003·84 cites·15 claims
- 0483US6396129B1Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 28, 2002·36 cites·7 claims
- 0579US6696749B1Package structure having tapering support bars and leadsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 24, 2004·33 cites·11 claims
- 0678US6437447B1Dual-sided chip package without a die padSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 20, 2002·33 cites·12 claims
- 0767US6495908B2Multi-chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 17, 2002·22 cites·19 claims
- 0860US6680531B2Multi-chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 20, 2004·13 cites·12 claims
- 0931US2002060358A1Package of an image sensor deviceFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chin-Yuan Hung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →