Inventor · disambiguated record
Ching-Wei Hung
Also filed as: HUNG CHING WEI
2 granted patents·5 pending applications·15 citations·filing 2008–2016
56Inventor score
Files withPOWERTECH TECHNOLOGY INC3FAN WEN-JENG1HUNG CHING-WEI1POWERTECH TECHNOLOGY CORP1YU PING HSUN1
Top patents by PatentIndex Score
7 records- 0182US7884472B2Semiconductor package having substrate ID code and its fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2008·Granted Feb 8, 2011·13 cites·6 claims
- 0249US8159063B2Substrate and package with micro BGA configurationHUNG CHING-WEI·Filed 2009·Granted Apr 17, 2012·2 cites·15 claims
- 0341US2009236732A1Thermally-enhanced multi-hole semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 0439US2009230543A1Semiconductor package structure with heat sinkYU PING HSUN·Filed 2008·Application pending·0 cites
- 0538US2009223435A1Substrate panelPOWERTECH TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 0637US2010147565A1Window ball grid array substrate and its package structureFAN WEN-JENG·Filed 2008·Application pending·0 cites
- 0732US2017229426A1Fan-out back-to-back chip stacked packages and the method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ching-Wei Hung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →