Inventor · disambiguated record
Chang-Youn Hwang
Also filed as: HWANG CHANG-YOUN
27 granted patents·13 pending applications·298 citations·filing 2002–2023
96Inventor score
Files withHYNIX SEMICONDUCTOR INC14SAMSUNG ELECTRONICS CO LTD13SK HYNIX INC6HWANG CHANG-YOUN4AHN HYUN1
Top patents by PatentIndex Score
40 records- 0196US9425200B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted Aug 23, 2016·42 cites·21 claims
- 0296US7414213B2Manufacturing method of keypad for mobile phone and keypad manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 19, 2008·97 cites·18 claims
- 0394US9620451B2Semiconductor memory device with selectively located air gapsSK HYNIX INC·Filed 2016·Granted Apr 11, 2017·15 cites·12 claims
- 0494US9337203B2Semiconductor device with line-type air gaps and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted May 10, 2016·31 cites·16 claims
- 0592US10411014B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2016·Granted Sep 10, 2019·7 cites·10 claims
- 0692US9699926B2Case, method of manufacturing case, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 4, 2017·13 cites·22 claims
- 0788US10153799B2Electronic device case and material layer details of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 11, 2018·5 cites·18 claims
- 0885US9306268B2Electronic device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 5, 2016·5 cites·28 claims
- 0982US11296088B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2019·Granted Apr 5, 2022·2 cites·15 claims
- 1081US7709367B2Method for fabricating storage node contact in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted May 4, 2010·12 cites·16 claims
- 1179US6569778B2Method for forming fine pattern in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2002·Granted May 27, 2003·22 cites·19 claims
- 1278US11310930B2Electronic device having waterproof structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 19, 2022·3 cites·20 claims
- 1376USRE50182EElectronic device case and material layer details of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·38 claims
- 1475US7427564B2Method for forming storage node contact plug in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Sep 23, 2008·7 cites·22 claims
- 1574US9867298B2Case frame and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 9, 2018·1 cites·16 claims
- 1668US8034714B2Semiconductor device and method of fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Oct 11, 2011·3 cites·12 claims
- 1767US8457695B2Mobile communication terminal having fragrance memberHWANG CHANG YOUN·Filed 2008·Granted Jun 4, 2013·4 cites·18 claims
- 1867US6867145B2Method for fabricating semiconductor device using photoresist pattern formed with argon fluoride laserHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Mar 15, 2005·11 cites·30 claims
- 1962US7419896B2Method for forming landing plug contact in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2005·Granted Sep 2, 2008·3 cites·9 claims
- 2060US7842593B2Semiconductor device and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Nov 30, 2010·1 cites·13 claims
- 2159US2015065209A1Cover member and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2258USRE49451EElectronic device case and material layer details of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·37 claims
- 2358US7745331B2Method for fabricating contact plug in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jun 29, 2010·1 cites·10 claims
- 2458US2025024660A1Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 2555US7160814B2Method for forming contact in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2004·Granted Jan 9, 2007·5 cites·15 claims
- 2653US7646956B2Optical waveguide sheet and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 12, 2010·2 cites·24 claims
- 2752US2013257241A1Method for manufacturing case frame and an electronic device employing thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2852US2007161183A1Method for fabricating semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 2950US6703314B2Method for fabricating semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Mar 9, 2004·3 cites·8 claims
- 3048US7226829B2Method for fabricating semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2003·Granted Jun 5, 2007·3 cites·24 claims
- 3147US9070583B2Semiconductor device and method of fabricating the sameHWANG CHANG YOUN·Filed 2011·Granted Jun 30, 2015·0 cites·10 claims
- 3247US2008111280A1Temperature control system for mold and injection molding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3346US2008153276A1Method for Manufacturing Semiconductor DeviceHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 3441US2008153279A1Method For Manufacturing Semiconductor DeviceHWANG CHANG YOUN·Filed 2007·Application pending·0 cites
- 3541US2008160740A1Method For Manufacturing Semiconductor DeviceAHN HYUN·Filed 2007·Application pending·0 cites
- 3640US2012088077A1Injection preform having pattern on surface thereof and method of manufacturing the sameJUNG HYUN-JUNG·Filed 2011·Application pending·0 cites
- 3738US2011260226A1Semiconductor device and method for forming the sameHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 3835US2003124465A1Method for fabricating semiconductor device capable of covering facet on plugFiled 2002·Application pending·0 cites
- 3935US2006292498A1Method for forming contact hole in semiconductor deviceHWANG CHANG-YOUN·Filed 2005·Application pending·0 cites
- 4031US2018098448A1Electronic device including housing having partitioning part and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →