Inventor · disambiguated record
Chi Seok Hwang
Also filed as: HWANG CHI S · HWANG CHI SEOK
0 granted patents·3 pending applications·0 citations·filing 2004–2011
Files withCHOI HAN NIM2
Top patents by PatentIndex Score
3 records- 0140US2009136748A1Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0239US2005142817A1Surface planarization method of sequential lateral solidification crystallized poly-silicon thin filmFiled 2004·Application pending·0 cites
- 0335US2012029117A1Adhesive film for semiconductor assemblyCHOI HAN NIM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →