Inventor · disambiguated record
Chang Sun Hwang
Also filed as: HWANG CHANG SUN
15 granted patents·1 pending application·108 citations·filing 1999–2021
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10HYUNDAI MOTOR CO LTD3PARK JOON-SANG1YU IL TECH CO LTD1YUILTECH CO LTD1
Top patents by PatentIndex Score
16 records- 0191US11417675B2Three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·8 cites·20 claims
- 0290US11637019B2Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structuresSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0388US6668219B2Artificial intelligence diagnostic device for automobile and control device for the sameYU IL TECH CO LTD·Filed 2001·Granted Dec 23, 2003·43 cites·21 claims
- 0481US10821572B2Method of controlling a temperature of a chemical mechanical polishing process, temperature control, and CMP apparatus including the temperature controlSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 3, 2020·2 cites·18 claims
- 0579US10403640B2Semiconductor devices including insulating capping structuresSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·3 cites·20 claims
- 0676US8133756B2Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the samePARK JOON-SANG·Filed 2009·Granted Mar 13, 2012·8 cites·18 claims
- 0773US6278919B1Apparatus for diagnosing and indicating operational failure in automobilesYUILTECH CO LTD·Filed 1999·Granted Aug 21, 2001·38 cites·16 claims
- 0870US9870950B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 16, 2018·2 cites·20 claims
- 0965US8796127B2Methods of fabricating semiconductor devices and semiconductor devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 5, 2014·2 cites·14 claims
- 1054US11087990B2Semiconductor device with a stacked structure and a capping insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·19 claims
- 1151US9347445B2Lubrication apparatus of high pressure pump for common rail systemHYUNDAI MOTOR CO LTD·Filed 2013·Granted May 24, 2016·0 cites·9 claims
- 1250US11889688B2Semiconductor device with key pattern and electronic system including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 1349US11744079B2Semiconductor device, an electronic system including the same, and a method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1447US9528403B2Lubrication device of high pressure pump for common rail systemHYUNDAI MOTOR CO LTD·Filed 2013·Granted Dec 27, 2016·0 cites·11 claims
- 1544US9023704B2Method for fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 5, 2015·0 cites·18 claims
- 1641US2014165957A1Lubrication apparatus of high pressure pump for common rail systemHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →