Inventor · disambiguated record
Chulyong Jang
Also filed as: JANG CHULYONG
7 granted patents·1 pending application·5 citations·filing 2021–2025
74Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0185US11626370B2Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0283US11923286B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 0377US11824023B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·1 cites·17 claims
- 0471US12224258B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0566US12315818B2Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 27, 2025·0 cites·13 claims
- 0662US2025149476A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0757US11810837B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 0847US12021055B2Semiconductor package and method for manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →