Inventor · disambiguated record
Chun-Lung Jao
Also filed as: JAO CHUN-LUNG
2 granted patents·1 pending application·0 citations·filing 2014–2023
25Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0162US12512432B2Dicing process in packages comprising organic interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 0251US2025132223A1Devices and methods for forming devices with lidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0347US9431360B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →