Inventor · disambiguated record
Chan Woo Jeong
Also filed as: JEONG CHAN WOO
7 granted patents·1 pending application·25 citations·filing 2015–2023
80Inventor score
Top patents by PatentIndex Score
8 records- 0190US9607968B1Flexible packages including chipsSK HYNIX INC·Filed 2016·Granted Mar 28, 2017·9 cites·20 claims
- 0287US9437580B1Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the sameSK HYNIX INC·Filed 2015·Granted Sep 6, 2016·11 cites·14 claims
- 0375US9484322B1Semiconductor packages with sliding interconnect structureSK HYNIX INC·Filed 2015·Granted Nov 1, 2016·3 cites·12 claims
- 0469US9972568B2Stretchable semiconductor packages and semiconductor devices including the sameSK HYNIX INC·Filed 2017·Granted May 15, 2018·1 cites·19 claims
- 0565US9806060B2Flexible packages including chipsSK HYNIX INC·Filed 2017·Granted Oct 31, 2017·1 cites·19 claims
- 0655US2024123924A1High Voltage Connector for VehicleHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 0750US9806016B2Stretchable semiconductor packages and semiconductor devices including the sameSK HYNIX INC·Filed 2016·Granted Oct 31, 2017·0 cites·15 claims
- 0837US9846144B2Apparatus and method for detecting defect of press panelHYUNDAI MOTOR CO LTD·Filed 2015·Granted Dec 19, 2017·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →