Inventor · disambiguated record
Cha-Jea Jo
Also filed as: JO CHA-JEA
33 granted patents·12 pending applications·169 citations·filing 2007–2023
96Inventor score
Top patents by PatentIndex Score
45 records- 0197US9997446B2Semiconductor package including a rewiring layer with an embedded chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 12, 2018·24 cites·19 claims
- 0296US10083939B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 25, 2018·12 cites·20 claims
- 0396US10026724B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·23 cites·20 claims
- 0496US9666551B1Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 30, 2017·17 cites·20 claims
- 0595US9589945B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 7, 2017·15 cites·16 claims
- 0694US10224272B2Semiconductor package including a rewiring layer with an embedded chipSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 5, 2019·10 cites·20 claims
- 0793US11637140B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0891US10141286B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·8 cites·19 claims
- 0989US10658341B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 19, 2020·3 cites·20 claims
- 1087US10971535B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 6, 2021·4 cites·19 claims
- 1186US10680025B2Semiconductor package and image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·4 cites·19 claims
- 1286US8912048B2Method of fabricating semiconductor device including a substrate attached to a carrierSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 16, 2014·8 cites·15 claims
- 1385US10134702B2Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·4 cites·17 claims
- 1484US11244936B2Semiconductor device package and apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·3 cites·13 claims
- 1583US10373935B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 6, 2019·2 cites·20 claims
- 1682US10867970B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 15, 2020·1 cites·17 claims
- 1780US7626260B2Stack-type semiconductor device having cooling path on its bottom surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·9 cites·15 claims
- 1879US10535534B2Method of fabricating an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 14, 2020·2 cites·19 claims
- 1979US8088648B2Method of manufacturing a chip stack packageJO CHA-JEA·Filed 2010·Granted Jan 3, 2012·6 cites·15 claims
- 2078US10750112B2Substrate structures for image sensor modules and image sensor modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·18 claims
- 2177US12113087B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2274US11610865B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 2373US11018026B2Interposer, semiconductor package, and method of fabricating interposerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·1 cites·17 claims
- 2472US8980689B2Method of fabricating semiconductor multi-chip stack packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
- 2571US10991677B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 27, 2021·0 cites·20 claims
- 2664US9728424B2Method of fabricating a packaged integrated circuit with through-silicon via an inner substrateSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 8, 2017·1 cites·20 claims
- 2764US8178969B2Flip chip packageLEE JONG-JOO·Filed 2009·Granted May 15, 2012·2 cites·19 claims
- 2862US7638365B2Stacked chip package and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 29, 2009·2 cites·29 claims
- 2960US9543231B2Stacked semiconductor packageCHOI YUN-SEOK·Filed 2015·Granted Jan 10, 2017·1 cites·18 claims
- 3060US2008157287A1Semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3159US2024162181A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3252US8723315B2Flip chip packageLEE JONG-JOO·Filed 2012·Granted May 13, 2014·0 cites·14 claims
- 3351US2008230923A1Chip stack package and method of manufacturing the chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3450US2018315740A1Semiconductor device package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 3549US9618716B2Photonic integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 11, 2017·0 cites·19 claims
- 3646US9159659B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·16 claims
- 3746US2008157332A1Stacked semiconductor packages and methods of manufacturing stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3845US10483150B2Apparatus for stacking semiconductor chips in a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 19, 2019·0 cites·19 claims
- 3944US2014252605A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4044US2008141933A1Semiconductor plating system for plating semiconductor objectSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4143US2009278561A1Probe card having redistributed wiring probe needle structure and probe card module using the sameJO CHA-JEA·Filed 2008·Application pending·0 cites
- 4242US2014239478A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4340US2015162265A1Semiconductor package and method of manufacturing the sameJO CHA-JEA·Filed 2014·Application pending·0 cites
- 4437US2017047310A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4535US2016225721A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →