Inventor · disambiguated record
Cheol Ho Joh
Also filed as: JOH CHEOL HO
11 granted patents·6 pending applications·53 citations·filing 2003–2016
86Inventor score
Top patents by PatentIndex Score
17 records- 0192US8564141B2Chip unit and stack package having the sameLEE KYU WON·Filed 2011·Granted Oct 22, 2013·32 cites·16 claims
- 0280US9093441B2Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the sameSK HYNIX INC·Filed 2013·Granted Jul 28, 2015·6 cites·19 claims
- 0376US9165899B2Stacked package and method for manufacturing the sameSK HYNIX INC·Filed 2013·Granted Oct 20, 2015·4 cites·15 claims
- 0469US7705468B2Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Apr 27, 2010·5 cites·13 claims
- 0565US9490187B2Semiconductor package on which semiconductor chip is mounted on substrate with windowSK HYNIX INC·Filed 2014·Granted Nov 8, 2016·2 cites·18 claims
- 0663US9082634B2Stack package and method for manufacturing the sameSHIN HEE-MIN·Filed 2010·Granted Jul 14, 2015·2 cites·11 claims
- 0760US8822271B2Method and apparatus for manufacturing chip packageSK HYNIX INC·Filed 2013·Granted Sep 2, 2014·1 cites·15 claims
- 0859US7859108B2Flip chip package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 28, 2010·1 cites·19 claims
- 0948US2013256887A1Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 1047US8951810B2Methods for forming interconnection line using screen printing techniqueSK HYNIX INC·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 1147US2010092718A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersSHIN HEE MIN·Filed 2008·Application pending·0 cites
- 1246US9305912B2Stack package and method for manufacturing the sameSK HYNIX INC·Filed 2015·Granted Apr 5, 2016·0 cites·6 claims
- 1345US2011189928A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersHYNIX SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 1444US8476751B2Stacked semiconductor package and method for manufacturing the sameLEE KYU WON·Filed 2011·Granted Jul 2, 2013·0 cites·13 claims
- 1541US2008061406A1Semiconductor package having electromagnetic shielding partJOH CHEOL HO·Filed 2007·Application pending·0 cites
- 1636US2004262773A1Chip-stacked packageFiled 2003·Application pending·0 cites
- 1734US2017162516A1Semiconductor packages including side shielding partsSK HYNIX INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →