Inventor · disambiguated record
Changeun Joo
Also filed as: JOO CHANGEUN
8 granted patents·3 pending applications·7 citations·filing 2019–2024
77Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0191US11990439B2Semiconductor package including under bump metallization padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·4 cites·15 claims
- 0285US11373955B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·2 cites·20 claims
- 0370US2024266269A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0468US11961812B2Semiconductor packages having viasSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 16, 2024·0 cites·20 claims
- 0564US11978696B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0662US11810864B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·19 claims
- 0762US11264339B2Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 1, 2022·1 cites·14 claims
- 0860US11587898B2Semiconductor packages having viasSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 0952US2023411355A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1052US2024055403A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1144US11972966B2Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring strutureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →