Inventor · disambiguated record
Chung-Sam Jun
Also filed as: JUN CHUNG-SAM
72 granted patents·22 pending applications·331 citations·filing 1998–2020
98Inventor score
Top patents by PatentIndex Score
94 records- 0187US9733178B2Spectral ellipsometry measurement and data analysis device and related systems and methodsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 15, 2017·3 cites·16 claims
- 0287US9659743B2Image creating method and imaging system for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·4 cites·20 claims
- 0386US7186280B2Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 6, 2007·14 cites·17 claims
- 0483US9934939B2Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 3, 2018·5 cites·13 claims
- 0583US9831626B2Broadband light source and optical inspector having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 28, 2017·2 cites·17 claims
- 0683US7526959B2Method of inspecting a substrate using ultrasonic waves and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 5, 2009·8 cites·27 claims
- 0782US8126258B2Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the sameYANG YU-SIN·Filed 2007·Granted Feb 28, 2012·9 cites·12 claims
- 0882US8050488B2Method of analyzing a wafer sampleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 1, 2011·6 cites·12 claims
- 0982US6528333B1Method of and device for detecting micro-scratchesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Mar 4, 2003·28 cites·18 claims
- 1081US11043433B2Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 22, 2021·1 cites·26 claims
- 1181US10249544B2Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 2, 2019·2 cites·20 claims
- 1281US6366688B1Apparatus and method for contact failure inspection in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Apr 2, 2002·53 cites·54 claims
- 1379US8034641B2Method for inspection of defects on a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 11, 2011·5 cites·20 claims
- 1479US7428328B2Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 23, 2008·7 cites·27 claims
- 1577US9261532B1Conductive atomic force microscope and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 16, 2016·2 cites·20 claims
- 1677US7486392B2Method of inspecting for defects and apparatus for performing the methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·6 cites·11 claims
- 1776US6544802B1Wafer inspection system and method for selectively inspecting conductive pattern defectsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 8, 2003·20 cites·13 claims
- 1876US6449037B2Method of and device for detecting micro-scratchesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 10, 2002·19 cites·4 claims
- 1974US7426031B2Method and apparatus for inspecting target defects on a waferSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 16, 2008·4 cites·21 claims
- 2073US10593032B2Defect inspection method and defect inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 17, 2020·1 cites·18 claims
- 2173US10373796B2Method of inspecting wafer using electron beamSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 6, 2019·2 cites·20 claims
- 2273US9455206B2Overlay measuring method and system, and method of manufacturing semiconductor device using the sameYUN SEONG-JIN·Filed 2015·Granted Sep 27, 2016·2 cites·10 claims
- 2373US7385689B2Method and apparatus for inspecting substrate patternSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 10, 2008·5 cites·35 claims
- 2472US7728966B2Optical inspection tool having lens unit with multiple beam paths for detecting surface defects of a substrate and methods of using sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 1, 2010·4 cites·31 claims
- 2572US6803241B2Method of monitoring contact hole of integrated circuit using corona chargesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 12, 2004·19 cites·8 claims
- 2670US8055056B2Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 8, 2011·3 cites·14 claims
- 2769US7747063B2Method and apparatus for inspecting a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 29, 2010·4 cites·10 claims
- 2869US7446865B2Method of classifying defectsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 4, 2008·3 cites·17 claims
- 2968US7697130B2Apparatus and method for inspecting a surface of a waferSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 13, 2010·3 cites·17 claims
- 3067US7394279B2Method of measuring a surface voltage of an insulating layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 1, 2008·4 cites·15 claims
- 3166US7433032B2Method and apparatus for inspecting defects in multiple regions with different parametersSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 7, 2008·2 cites·24 claims
- 3265US6650408B2Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 18, 2003·12 cites·19 claims
- 3363US8759763B2Method and apparatus to measure step height of device using scanning electron microscopeSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jun 24, 2014·1 cites·19 claims
- 3463US8184899B2Method of detecting a defect on an objectYANG YU-SIN·Filed 2009·Granted May 22, 2012·3 cites·15 claims
- 3563US6800863B2Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 5, 2004·6 cites·40 claims
- 3662US6515293B1Method and apparatus for detecting thickness of thin layer formed on a waferSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 4, 2003·9 cites·2 claims
- 3760US7666069B2Wafer holder and wafer conveyor equipped with the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·1 cites·12 claims
- 3858US7197426B2Method and apparatus for measuring thickness of metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 27, 2007·3 cites·20 claims
- 3957US2019214316A1Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4056US2021026152A1Multilayer structure inspection apparatus and method, and semiconductor device fabricating method using the inspection methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4155US7289661B2Apparatus and method for inspecting a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 30, 2007·5 cites·22 claims
- 4255US7081952B2Method and apparatus for obtaining an image using a selective combination of wavelengths of lightSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 25, 2006·2 cites·12 claims
- 4354US7046760B2Method of measuring and controlling concentration of dopants of a thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 16, 2006·4 cites·34 claims
- 4452US10969428B2Method of inspecting pattern defectSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 6, 2021·0 cites·14 claims
- 4552US10222414B2Apparatus and method for exchanging probeSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 5, 2019·0 cites·20 claims
- 4652US7280233B2Method and apparatus for inspecting an edge exposure area of a waferSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 9, 2007·4 cites·21 claims
- 4752US6927077B2Method and apparatus for measuring contamination of a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 9, 2005·4 cites·21 claims
- 4851US10585115B2Scanning probe inspectorSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 10, 2020·0 cites·18 claims
- 4951US7027638B2Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 11, 2006·4 cites·18 claims
- 5051US6815236B2Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 9, 2004·3 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →