Inventor · disambiguated record
Chungsam Jun
Also filed as: JUN CHUNGSAM
14 granted patents·4 pending applications·16 citations·filing 2003–2023
86Inventor score
Top patents by PatentIndex Score
18 records- 0185US9612212B1Ellipsometer and method of inspecting pattern asymmetry using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 4, 2017·5 cites·12 claims
- 0284US9466537B2Method of inspecting semiconductor device and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 11, 2016·5 cites·20 claims
- 0383US11754510B2Inspection system of semiconductor wafer and method of driving the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·1 cites·16 claims
- 0479US11988495B2Through-focus image-based metrology device, operation method thereof, and computing device for executing the operationSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·1 cites·16 claims
- 0576US9719946B2Ellipsometer and method of inspecting pattern asymmetry using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 1, 2017·2 cites·8 claims
- 0672US12130242B2Inspection system of semiconductor wafer and method of driving the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·18 claims
- 0770US9583402B2Method of manufacturing a semiconductor device using semiconductor measurement systemSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 28, 2017·2 cites·19 claims
- 0858US12352808B2Substrate inspection apparatus and substrate inspection methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0953US12362139B2Semiconductor inspection apparatus and semiconductor inspection method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1049US11754517B2Inspection apparatus for inspecting semiconductor devices using charged particlesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·16 claims
- 1149US2018096903A1Fan-out panel level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1248US9892980B2Fan-out panel level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 13, 2018·0 cites·16 claims
- 1347US2023266258A1Method of inspecting semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1440US10269111B2Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·19 claims
- 1538US9455121B2Semiconductor inspection system and methods of inspecting a semiconductor device using the sameKIM HYUNWOO·Filed 2015·Granted Sep 27, 2016·0 cites·18 claims
- 1636US10088297B2Apparatus and method for measuring thicknessSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·10 claims
- 1734US2017200658A1Methods of inspecting substrates and semiconductor fabrication methods incorporating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1828US2003210408A1Method of measuring thickness of layerFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →