Inventor · disambiguated record
Chung-Kyung Jung
Also filed as: JUNG CHUNG-KYUNG
9 granted patents·30 pending applications·11 citations·filing 2007–2015
80Inventor score
Top patents by PatentIndex Score
39 records- 0172US7642119B2Method for manufacturing image sensorDONGBU HITEK CO LTD·Filed 2008·Granted Jan 5, 2010·3 cites·19 claims
- 0271US8278209B2Method for manufacturing a semiconductor device using a hardmask layerJUNG CHUNG-KYUNG·Filed 2009·Granted Oct 2, 2012·3 cites·15 claims
- 0363US8138086B2Method for manufacturing flash memory deviceJUNG CHUNG-KYUNG·Filed 2009·Granted Mar 20, 2012·3 cites·10 claims
- 0459US8003531B2Method for manufacturing flash memory deviceDONGBU HITEK CO LTD·Filed 2009·Granted Aug 23, 2011·2 cites·20 claims
- 0555US2013264618A1Method for manufacturing backside-illuminated image sensorDONGBU HITEK CO LTD·Filed 2013·Application pending·0 cites
- 0653US8084290B2Method for fabricating CMOS image sensorJUNG CHUNG-KYUNG·Filed 2009·Granted Dec 27, 2011·0 cites·13 claims
- 0751US2010117184A1Method of manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 0851US2010093128A1Method for manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 0951US2010164037A1Method for manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 1051US2010120194A1Method of manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 1150US9845444B2Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 19, 2017·0 cites·14 claims
- 1249US2009166692A1Cmos image sensor and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Application pending·0 cites
- 1348US2009170236A1Manufacturing method of image sensorJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 1448US2009155950A1Cmos image sensor and method for fabricating the sameJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 1548US2009166791A1Method for manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 1646US8153518B2Method for fabricating metal interconnection of semiconductor deviceJUNG CHUNG-KYUNG·Filed 2009·Granted Apr 10, 2012·0 cites·12 claims
- 1746US2008286896A1Method for manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 1846US2008286897A1Method for Manufacturing Image SensorJUNG CHUNG KYUNG·Filed 2008·Application pending·0 cites
- 1946US2008274580A1Method for manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 2046US2008272451A1Image Sensor and Method of Manufacturing The SameJUNG CHUNG KYUNG·Filed 2008·Application pending·0 cites
- 2144US2010167455A1Method for fabrication of cmos image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2244US2010120195A1Method for manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2344US2010167536A1Method for removing hardened polymer residueJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2444US2010163294A1Method for forming metal line of semiconductor deviceJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2544US2010159697A1Method for manufacturing semiconductor deviceJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2644US2010105212A1Method for fabricating semiconductor deviceJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2743US2010117174A1Method of manufacturing image sensorJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2843US2010155955A1Method for manufacturing system-in-packageJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 2943US2009162984A1Method for manufacturing semiconductor deviceJUNG CHUNG KYUNG·Filed 2008·Application pending·0 cites
- 3043US2010167530A1Method for forming metal line of semiconductor deviceJUNG CHUNG-KYUNG·Filed 2009·Application pending·0 cites
- 3142US9156681B2Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·14 claims
- 3242US2009029548A1Method for removing polymer residue from metal lines of semiconductor deviceJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 3341US2009001544A1Chip stacked structure and method of fabricating the sameJUNG CHUNG-KYUNG·Filed 2008·Application pending·0 cites
- 3440US2010159680A1Method for Manufacturing Semiconductor DeviceJUNG CHUNG KYUNG·Filed 2009·Application pending·0 cites
- 3540US2008064219A1Method of removing photoresistJUNG CHUNG-KYUNG·Filed 2007·Application pending·0 cites
- 3638US2009140373A1Method of Manufacturing LCD Driver ICJUNG CHUNG KYUNG·Filed 2008·Application pending·0 cites
- 3738US2009142914A1Method for Manufacturing Semiconductor DeviceJUNG CHUNG KYUNG·Filed 2008·Application pending·0 cites
- 3837US8765511B2Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2013·Granted Jul 1, 2014·0 cites·7 claims
- 3932US2014077372A1Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →