Inventor · disambiguated record
Chulho Jung
Also filed as: JUNG CHULHO
6 granted patents·7 pending applications·15 citations·filing 2016–2025
75Inventor score
Top patents by PatentIndex Score
13 records- 0193US10651260B2Electronic component, electric device including the sameSAMSUNG DISPLAY CO LTD·Filed 2018·Granted May 12, 2020·11 cites·19 claims
- 0286US11031454B2Electronic component, electric device including the sameSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
- 0371US10064274B2Conductive adhesive film and method of attaching electronic device using the sameSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·12 claims
- 0468US11877485B2Electronic component, electric device including the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·27 claims
- 0567US12461558B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·19 claims
- 0660US2025343064A1Method of fabricating a semiconductor package and a semiconductor package fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025244681A1Electronic device and method of operation thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025054852A1Combination-type semiconductor package for improving package reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0957US12500110B2Substrate processing apparatusSEMES CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 1052US2024014049A1Release film for mold process, and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1149US2023377852A1Substrate processing apparatusSEMES CO LTD·Filed 2023·Application pending·0 cites
- 1247US2025279404A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1344US2024254594A1Aluminum alloy, method for manufacturing same, and parts using sameLG ELECTRONICS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →