Inventor · disambiguated record
Chanyuth Junjuewong
Also filed as: JUNJUEWONG CHANYUTH
3 granted patents·0 citations·filing 2019–2021
42Inventor score
Files withMICROCHIP TECH INC3
Top patents by PatentIndex Score
3 records- 0147US11127660B2Surface-mount integrated circuit package with coated surfaces for improved solder connectionMICROCHIP TECH INC·Filed 2019·Granted Sep 21, 2021·0 cites·16 claims
- 0247US11101200B2Surface-mount integrated circuit package with coated surfaces for improved solder connectionMICROCHIP TECH INC·Filed 2019·Granted Aug 24, 2021·0 cites·16 claims
- 0336US11887864B2Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminalsMICROCHIP TECH INC·Filed 2021·Granted Jan 30, 2024·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →