Inventor · disambiguated record
Chang-Kun Kang
Also filed as: KANG CHANG-KUN
3 granted patents·1 pending application·1 citations·filing 2016–2023
50Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0159US11309345B2Protective film composition and method of manufacturing semiconductor package by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 0258US9922846B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 20, 2018·1 cites·25 claims
- 0353US10854666B2Protective film composition and method of manufacturing semiconductor package by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·9 claims
- 0453US2024170431A1Bonding structure of semiconductor package device, semiconductor package device, and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →