Inventor · disambiguated record
Chen-Yuan Kao
Also filed as: KAO CHEN-YUAN
50 granted patents·11 pending applications·114 citations·filing 2013–2025
97Inventor score
Top patents by PatentIndex Score
61 records- 0197US11374127B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·4 cites·20 claims
- 0297US9754822B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·30 cites·20 claims
- 0396US11532561B2Different via configurations for different via interface requirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·20 claims
- 0496US10923573B2Forming metal contacts on metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·8 cites·20 claims
- 0595US11652149B2Common rail contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·6 cites·20 claims
- 0695US10985061B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·8 cites·20 claims
- 0795US10483165B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·8 cites·20 claims
- 0894US10186456B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·8 cites·20 claims
- 0991US11929314B2Interconnect structures including a fin structure and a metal capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 1090US11535950B2Electro-plating and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 27, 2022·1 cites·20 claims
- 1190US10727350B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·4 cites·20 claims
- 1290US9518334B2Electro-plating and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 13, 2016·3 cites·19 claims
- 1389US12176435B2Method for forming fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·1 cites·20 claims
- 1488US11552018B2Chemical direct pattern plating methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·20 claims
- 1588US10418453B2Forming metal contacts on metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 17, 2019·3 cites·20 claims
- 1688US10269627B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 1788US10199500B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·20 claims
- 1887US10840134B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·3 cites·20 claims
- 1987US2024395939A1Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2086US12342598B2Forming metal contacts on metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 2186US2025357295A1Interconnect structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2285US2024363409A1Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2384US12278188B2Different via configurations for different via interface requirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 2483US12166128B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 2583US2025239527A1Different Via Configurations for Different Via Interface RequirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2680US11901426B2Forming metal contacts on metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2779US12142565B2Different via configurations for different via interface requirementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2879US11777035B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 2977US2024387655A1Common rail contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3077US2024379378A1Metal Contacts on Metal Gates and Methods ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3175US11182524B1Fixing device for clock tree and fixing method thereofGLOBAL UNICHIP CORP·Filed 2021·Granted Nov 23, 2021·1 cites·10 claims
- 3275US9786604B2Metal cap apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·2 cites·19 claims
- 3375US2024170381A1Interconnect structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3474US11532717B2Forming metal contacts on metal gatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3574US11107896B2Vertical interconnect features and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 3674US10755945B2Metal contacts on metal gates and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 3774US9209073B2Metal cap apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·3 cites·22 claims
- 3873US12068197B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 3973US10714329B2Pre-clean for contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·1 cites·20 claims
- 4072US10998269B2Chemical direct pattern plating methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·0 cites·20 claims
- 4171US11328952B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 4271US2023290842A1Common rail contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4370US10508356B2Electro-plating and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·0 cites·20 claims
- 4469US12159837B2Chemical direct pattern plating methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 4569US10909291B2Circuit correction system and method for increasing coverage of scan testGLOBAL UNICHIP CORP·Filed 2019·Granted Feb 2, 2021·1 cites·16 claims
- 4667US9632498B2Systems and methods of compensating for filling material losses in electroplating processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·2 cites·17 claims
- 4767US9601430B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·20 claims
- 4865US11855154B2Vertical interconnect features and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4962US12461150B2Testing circuitGLOBAL UNICHIP CORP·Filed 2023·Granted Nov 4, 2025·0 cites·6 claims
- 5062US11271112B2Method for forming fin field effect transistor (FINFET) device structure with conductive layer between gate and gate contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →