Inventor · disambiguated record
Chih-Hsun Ke
Also filed as: KE CHIH-HSUN
23 granted patents·7 pending applications·30 citations·filing 2011–2017
92Inventor score
Top patents by PatentIndex Score
30 records- 0176US8592857B2LED packageCHAN SHIUN-WEI·Filed 2011·Granted Nov 26, 2013·4 cites·12 claims
- 0276US8318514B2LED package, and mold and method of manufacturing the sameCHAN SHIUN-WEI·Filed 2011·Granted Nov 27, 2012·4 cites·8 claims
- 0375US8716744B2LED package, method for making the LED package and light source having the sameCHAN SHIUN-WEI·Filed 2011·Granted May 6, 2014·4 cites·11 claims
- 0473US8455901B2LED unit having self-connecting leadsCHAN SHIUN-WEI·Filed 2011·Granted Jun 4, 2013·2 cites·18 claims
- 0572US8409885B2Method for packaging light emitting diodeCHAN SHIUN-WEI·Filed 2011·Granted Apr 2, 2013·2 cites·12 claims
- 0672US8334175B1Manufacturing method of LED package structureKE CHIH-HSUN·Filed 2012·Granted Dec 18, 2012·2 cites·12 claims
- 0771US9899359B1Light emitting diode package structure, method for making the same, and flat panel light source having the sameADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Feb 20, 2018·2 cites·19 claims
- 0868US8587012B2LED package and mold of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2012·Granted Nov 19, 2013·2 cites·12 claims
- 0968US8564003B2LED packageKE CHIH-HSUN·Filed 2011·Granted Oct 22, 2013·1 cites·12 claims
- 1067US8998436B2Light source apparatus of backlight moduleKE CHIH-HSUN·Filed 2012·Granted Apr 7, 2015·3 cites·14 claims
- 1165US8507932B2LED unitKE CHIH-HSUN·Filed 2011·Granted Aug 13, 2013·2 cites·11 claims
- 1253US8802467B2Method of manufacturing encapsulation structure for encapsulating LED chipADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Aug 12, 2014·0 cites·10 claims
- 1350US2014134766A1Method of manufacturing light emitting device packageADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 1448US8546158B2Method for distributing phosphor particulates on LED chipCHAN SHIUN-WEI·Filed 2011·Granted Oct 1, 2013·0 cites·16 claims
- 1547US8674394B2Light emitting device package and method of manufacturing the sameCHAN SHIUN-WEI·Filed 2011·Granted Mar 18, 2014·0 cites·15 claims
- 1646US8268652B2Method for distributing fluorescence onto LED chipCHAN SHIUN-WEI·Filed 2011·Granted Sep 18, 2012·0 cites·13 claims
- 1742US8907371B2Light emitting diode package and light emitting device having the sameCHAN SHIUN-WEI·Filed 2011·Granted Dec 9, 2014·0 cites·20 claims
- 1842US8624389B2Light emitting diode moduleCHAN SHIUN-WEI·Filed 2011·Granted Jan 7, 2014·0 cites·9 claims
- 1942US2012091485A1Light emitting deviceCHAN SHIUN-WEI·Filed 2011·Application pending·0 cites
- 2041US8449153B2LED moduleLO HSING-FEN·Filed 2011·Granted May 28, 2013·0 cites·14 claims
- 2141US2012025258A1Light emitting diode package and light emitting diode moduleCHAN SHIUN-WEI·Filed 2011·Application pending·0 cites
- 2241US2012098004A1Light emitting diode packageKE CHIH-HSUN·Filed 2011·Application pending·0 cites
- 2340US8597964B2Manufacturing method of LED package structureKE CHIH-HSUN·Filed 2012·Granted Dec 3, 2013·0 cites·8 claims
- 2438US8513698B2LED packageCHAN SHIUN-WEI·Filed 2011·Granted Aug 20, 2013·0 cites·10 claims
- 2538US2012098010A1Light emitting element packageCHAN SHIUN-WEI·Filed 2011·Application pending·0 cites
- 2638US2012074437A1Led unit having uniform light emissionCHAN SHIUN-WEI·Filed 2011·Application pending·0 cites
- 2737US2012091487A1Light emitting diode package and method for manufacturing the sameCHAN SHIUN-WEI·Filed 2011·Application pending·0 cites
- 2832USD645830SHousing for light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Sep 27, 2011·1 cites·1 claims
- 2932USD645422SHousing for light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Sep 20, 2011·1 cites·1 claims
- 3029USD645423SHousing for light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Sep 20, 2011·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →