Inventor · disambiguated record
Chang-Gyu Kim
Also filed as: KIM CHANG G · KIM CHANG GYU
22 granted patents·12 pending applications·299 citations·filing 1991–2025
95Inventor score
Files withCORNING INC9SAMSUNG ELECTRONICS CO LTD9DONGBU ELECTRONICS CO LTD3HYNIX SEMICONDUCTOR INC3HYUNDAI MOTOR CO LTD1
Top patents by PatentIndex Score
34 records- 0192US11320568B2Curved surface films and methods of manufacturing the sameCORNING INC·Filed 2019·Granted May 3, 2022·3 cites·12 claims
- 0281US11927722B2Glass-ceramic articles having specified elastic modulus and fracture toughnessCORNING INC·Filed 2023·Granted Mar 12, 2024·0 cites·28 claims
- 0380US9442313B2Thermochromic window and method of fabricating the sameSAMSUNG CORNING PREC MAT CO LTD·Filed 2014·Granted Sep 13, 2016·3 cites·6 claims
- 0479US2025271600A1Transparent glass-ceramic articles with retained strength and display devices with the sameCORNING INC·Filed 2025·Application pending·0 cites
- 0576US12306378B2Transparent glass-ceramic articles with retained strength and display devices with the sameCORNING INC·Filed 2022·Granted May 20, 2025·0 cites·13 claims
- 0676US10578777B2Coated articles that include easy-to-clean coatingsCORNING INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 0775US5656337AMethod of forming a dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Aug 12, 1997·54 cites·11 claims
- 0874US9146408B2Thermochromic windowSAMSUNG CORNING PREC MAT CO·Filed 2013·Granted Sep 29, 2015·4 cites·12 claims
- 0969US11977205B2Curved surface films and methods of manufacturing the sameCORNING INC·Filed 2022·Granted May 7, 2024·0 cites·16 claims
- 1068US6797625B2Method of forming a protective step on the edge of a semiconductor waferDONGBU ELECTRONICS CO LTD·Filed 2002·Granted Sep 28, 2004·10 cites·6 claims
- 1167US5795811AMethod for forming insulating films in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Aug 18, 1998·44 cites·15 claims
- 1264US6071792AMethods of forming shallow trench isolation regions using plasma deposition techniquesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jun 6, 2000·35 cites·11 claims
- 1364US5352630AMethod for forming inter-metal dielectrics in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1992·Granted Oct 4, 1994·38 cites·11 claims
- 1460US6096622AMethod of forming shallow trench isolation of semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 1999·Granted Aug 1, 2000·24 cites·17 claims
- 1560US2025326685A1Uniform optical coatings disposed on 3d substratesCORNING INC·Filed 2025·Application pending·0 cites
- 1653US6001696ATrench isolation methods including plasma chemical vapor deposition and lift offSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Dec 14, 1999·20 cites·16 claims
- 1752US6319103B1Chemical mechanical polishing apparatusDONGBU ELECTRONICS CO LTD·Filed 2000·Granted Nov 20, 2001·5 cites·8 claims
- 1852US2015332802A1Polyamide resin compositionKOLON PLASTICS INC·Filed 2013·Application pending·0 cites
- 1949US2023002884A1Systems and methods for film depositionCORNING INC·Filed 2020·Application pending·0 cites
- 2046US5866466AMethods of fabricating trench isolation regions with risersSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Feb 2, 1999·15 cites·6 claims
- 2146US2002050007A1Cervical pillow for protection of cervical vertebraeFiled 2001·Application pending·0 cites
- 2246US2020158916A1Optical film structures, inorganic oxide articles with optical film structures, and methods of making the sameCORNING INC·Filed 2019·Application pending·0 cites
- 2342US2014228492A1Polyamide resin composition for wheel coverHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 2442US2005016686A1Apparatus and method for fabricating semiconductor devicesFiled 2004·Application pending·0 cites
- 2541US5366379ANeedle-puncturing position indicating apparatus utilizing a lighting display panel in fingers acupunctureYANG HONG MO·Filed 1991·Granted Nov 22, 1994·21 cites·4 claims
- 2640US7857986B2Chemical mechanical polishing slurry and chemical mechanical polishing apparatus and methodHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 28, 2010·0 cites·6 claims
- 2740US7186655B2Method for manufacturing semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2004·Granted Mar 6, 2007·2 cites·20 claims
- 2840US6083826AMethod for manufacturing semiconductor device capable of improving planarizationSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 4, 2000·10 cites·9 claims
- 2935US5560778AApparatus for forming a dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Oct 1, 1996·5 cites·2 claims
- 3035US2002137307A1Method for forming isolation layer of semiconductor deviceFiled 2001·Application pending·0 cites
- 3135US2002094659A1Method for forming isolation layer of semiconductor deviceFiled 2001·Application pending·0 cites
- 3233US6214735B1Method for planarizing a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Apr 10, 2001·5 cites·11 claims
- 3330US2005142988A1CMP process using slurry containing abrasive of low concentrationHYNIX SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
- 3430US2009151371A1Power saving type compressor and refrigerator with the same and method for controlling the sameLG ELECTRONICS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →