Inventor · disambiguated record
Choon Hwan Kim
Also filed as: KIM CHOON H · KIM CHOON HWAN
8 granted patents·3 pending applications·127 citations·filing 1994–2008
87Inventor score
Top patents by PatentIndex Score
11 records- 0193US7563718B2Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the sameHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jul 21, 2009·31 cites·19 claims
- 0277US7935591B2Method for fabricating PMOS transistor and method for forming dual gate using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted May 3, 2011·6 cites·6 claims
- 0365US5397742AMethod for forming tungsten plug for metal wiringHYUNDAI ELECTRONICS IND·Filed 1994·Granted Mar 14, 1995·41 cites·3 claims
- 0456US5447882AMethod for fabricating capacitor of semiconductor memory deviceHYUNDAI ELECTRONICS IND·Filed 1994·Granted Sep 5, 1995·18 cites·3 claims
- 0554US5702568AMethod of forming a via hole of a semiconductor device with spin-on-glass film sealed by an oxide filmHYUNDAI ELECTRONICS IND·Filed 1996·Granted Dec 30, 1997·21 cites·1 claims
- 0646US2009170311A1Method for fabricating contact in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 0744US2008233742A1Method of depositing aluminum layer and method of forming contact of semiconductor device using the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 0843US2009004848A1Method for fabricating interconnection in semiconductor deviceKIM CHOON HWAN·Filed 2007·Application pending·0 cites
- 0936US5940730AMethod of forming a contact hole of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted Aug 17, 1999·7 cites·3 claims
- 1035US7332391B2Method for forming storage node contacts in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Feb 19, 2008·0 cites·16 claims
- 1131US5595936AMethod for forming contacts in semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1995·Granted Jan 21, 1997·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →