Inventor · disambiguated record
Charles J. Kinzel
Also filed as: KINZEL CHARLES J
9 granted patents·5 pending applications·22 citations·filing 2019–2024
84Inventor score
Top patents by PatentIndex Score
14 records- 0193US11688677B2Continuous interconnects between heterogeneous materialsLIQUID WIRE INC·Filed 2021·Granted Jun 27, 2023·3 cites·10 claims
- 0292US11594480B2Structures with deformable conductorsLIQUID WIRE INC·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 0392US11088063B2Structures with deformable conductorsLIQUID WIRE INC·Filed 2019·Granted Aug 10, 2021·12 cites·9 claims
- 0490US11955420B2Structures with deformable conductorsLIQUID WIRE INC·Filed 2023·Granted Apr 9, 2024·1 cites·20 claims
- 0586US11682615B2Continuous interconnects between heterogeneous materialsLIQUID WIRE INC·Filed 2020·Granted Jun 20, 2023·2 cites·16 claims
- 0684US11882653B2Continuous interconnects between heterogeneous materialsLIQUID WIRE INC·Filed 2022·Granted Jan 23, 2024·1 cites·20 claims
- 0781US12125778B2Structures with deformable conductorsLIQUID WIRE INC·Filed 2024·Granted Oct 22, 2024·0 cites·20 claims
- 0877US2025151201A1Flexible and stretchable structuresLIQUID WIRE INC·Filed 2024·Application pending·0 cites
- 0976US12205878B2Continuous interconnects between heterogeneous materialsLIQUID WIRE INC·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1072US2023317314A1Structures with integrated conductorsLIQUID WIRE INC·Filed 2023·Application pending·0 cites
- 1167US12096563B2Flexible and stretchable structuresLIQUID WIRE INC·Filed 2021·Granted Sep 17, 2024·0 cites·19 claims
- 1251US2024147631A1Devices, systems, and methods for making and using highly sustainable circuitsLIQUID WIRE LLC·Filed 2022·Application pending·0 cites
- 1348US2024389225A1Stretchable and flexible metal film structuresLIQUID WIRE INC·Filed 2022·Application pending·0 cites
- 1447US2022270961A1Structures with deformable conductorsRONAY MARK WILLIAM·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →