Inventor · disambiguated record
Chih-Hsiang Ko
Also filed as: KO CHIH-HSIANG
9 granted patents·3 pending applications·45 citations·filing 2001–2022
85Inventor score
Files withIND TECH RES INST7INTEGRATED DEVICE TECH1INTEGRATED DEVICE TECHNOLOGY INC1LEE WEN-CHING1NOODOE CORP1
Top patents by PatentIndex Score
12 records- 0194US10720985B1Beam forming module implementation for high isolation and low noise figure systemsINTEGRATED DEVICE TECH·Filed 2019·Granted Jul 21, 2020·12 cites·20 claims
- 0293US11761776B2Charging scheduling systems and methods thereof for electric busesNOODOE CORP·Filed 2021·Granted Sep 19, 2023·3 cites·10 claims
- 0384US12191219B2Gas-permeable package lid of chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 7, 2025·1 cites·18 claims
- 0474US6485198B1Optoelectronic transceiver having integrated optical and electronic componentsIND TECH RES INST·Filed 2001·Granted Nov 26, 2002·20 cites·16 claims
- 0562US10756442B2Radio-frequency signal shielding and channel isolationINTEGRATED DEVICE TECHNOLOGY INC·Filed 2018·Granted Aug 25, 2020·0 cites·19 claims
- 0661US10122182B2Multi-turn coil on metal backplateQUALCOMM INC·Filed 2015·Granted Nov 6, 2018·1 cites·31 claims
- 0759US8239009B2Biosignal measurement modules and methodsLEE WEN-CHING·Filed 2009·Granted Aug 7, 2012·1 cites·21 claims
- 0858US7409124B2Fiber waveguide optical subassembly moduleIND TECH RES INST·Filed 2005·Granted Aug 5, 2008·3 cites·29 claims
- 0950US7198413B2Parallel optical subassembly module structureIND TECH RES INST·Filed 2004·Granted Apr 3, 2007·4 cites·16 claims
- 1038US2004218848A1Flexible electronic/optical interconnection film assembly and method for manufacturingIND TECH RES INST·Filed 2003·Application pending·0 cites
- 1137US2014185181A1Tunable capacitorIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1236US2007133928A1Canted-fiber duplex optical assemblyIND TECH RES INST·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →